Patents by Inventor Tung Long Lai

Tung Long Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-zone electrostatic chuck and chucking method
    Patent number: 7957118
    Abstract: A method for processing a semiconductor wafer comprises measuring data indicating an amount of warpage of the wafer. At least two different voltages are determined, based on the amount of warpage. The voltages are to be applied to respective portions of the wafer by an electrostatic chuck that is to hold the wafer. The at least two different voltages are applied to hold the respective portions of the wafer while performing a fabrication process on the wafer.
    Type: Grant
    Filed: April 30, 2009
    Date of Patent: June 7, 2011
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yi-Pin Chang, Tung Long Lai, Soon Kang Huang
  • Multi-Zone Electrostatic Chuck and Chucking Method
    Publication number: 20100277850
    Abstract: A method for processing a semiconductor wafer comprises measuring data indicating an amount of warpage of the wafer. At least two different voltages are determined, based on the amount of warpage. The voltages are to be applied to respective portions of the wafer by an electrostatic chuck that is to hold the wafer. The at least two different voltages are applied to hold the respective portions of the wafer while performing a fabrication process on the wafer.
    Type: Application
    Filed: April 30, 2009
    Publication date: November 4, 2010
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yi-Pin Chang, Tung Long Lai, Soon Kang Huang