Patents by Inventor Tung-Mei Tien

Tung-Mei Tien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor sawing method and system
    Patent number: 10703016
    Abstract: In one instance, a method of manufacturing an integrated circuit includes a method for dicing a semiconductor wafer that includes disposing the semiconductor wafer on a moveable cutting table, cutting the semiconductor wafer, and ejecting a clearing fluid across an exposed side of the semiconductor wafer, with full coverage across the semiconductor wafer, at least during the cutting of the semiconductor wafer. The ejecting clearing fluid is ejected to form a layer or membrane of fluid that clears or reduces other fluids from the exposed side or surface of the semiconductor wafer. Other aspects are presented.
    Type: Grant
    Filed: June 20, 2018
    Date of Patent: July 7, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Chi-Hung Chen, Tung-Mei Tien, Hung-Yu Wang
  • Semiconductor Sawing Method and System
    Publication number: 20190389091
    Abstract: In one instance, a method of manufacturing an integrated circuit includes a method for dicing a semiconductor wafer that includes disposing the semiconductor wafer on a moveable cutting table, cutting the semiconductor wafer, and ejecting a clearing fluid across an exposed side of the semiconductor wafer, with full coverage across the semiconductor wafer, at least during the cutting of the semiconductor wafer. The ejecting clearing fluid is ejected to form a layer or membrane of fluid that clears or reduces other fluids from the exposed side or surface of the semiconductor wafer. Other aspects are presented.
    Type: Application
    Filed: June 20, 2018
    Publication date: December 26, 2019
    Inventors: Chi-Hung Chen, Tung-Mei Tien, Hung-Yu Wang