Patents by Inventor Tung Sheng HSIEH

Tung Sheng HSIEH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11655955
    Abstract: The present invention provides a vehicle lamp structure, which includes a base, a circuit board, at least one first light-emitting element, a ring block, a first optical element and an optical cover. The circuit board is disposed above the base. The first light-emitting element is disposed on a top surface of the circuit board. The ring block is disposed above the circuit board. The first optical element is disposed above the first light-emitting element. The optical cover hoods the first optical element. Wherein, the ring block surrounds the first light-emitting element, and the first optical element and the optical cover are spaced by a distance.
    Type: Grant
    Filed: August 5, 2022
    Date of Patent: May 23, 2023
    Assignee: Min Hsiang Corporation
    Inventors: Shang-Kuei Tai, Ying-Fang Tseng, Tung-Sheng Hsieh, Chih-Wei Shih
  • Patent number: 9575117
    Abstract: Testing stacked devices. In accordance with a first method embodiment, a primary circuit assembly is accessed from a first circuit assembly carrier. The primary circuit assembly is placed into a test fixture. A secondary circuit assembly is accessed from a second circuit assembly carrier. The secondary circuit assembly is placed into the test fixture on top of the primary circuit assembly. The primary circuit assembly is tested in conjunction with said secondary circuit assembly while coupled together.
    Type: Grant
    Filed: April 18, 2013
    Date of Patent: February 21, 2017
    Assignee: ADVANTEST CORPORATION
    Inventors: Ling Qi, Tung Sheng Hsieh
  • Publication number: 20140312926
    Abstract: Testing stacked devices. In accordance with a first method embodiment, a primary circuit assembly is accessed from a first circuit assembly carrier. The primary circuit assembly is placed into a test fixture. A secondary circuit assembly is accessed from a second circuit assembly carrier. The secondary circuit assembly is placed into the test fixture on top of the primary circuit assembly. The primary circuit assembly is tested in conjunction with said secondary circuit assembly while coupled together.
    Type: Application
    Filed: April 18, 2013
    Publication date: October 23, 2014
    Applicant: Advantest Corporation
    Inventors: Ling QI, Tung Sheng HSIEH