Patents by Inventor Tung-Sheng Kuan

Tung-Sheng Kuan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5378651
    Abstract: A system and method for growing low defect density epitaxial layers of Si on imperfectly cleaned Si surfaces by either selective or blanket deposition at low temperatures using the APCVD process wherein a first thin, e.g., 10 nm, layer of Si is grown on the surface from silane or disilane, followed by the growing of the remainder of the film from dichlorosilane (DCS) at the same low temperature, e.g., 550.degree. C. to 850.degree. C. The subsequent growth of the second layer with DCS over the first layer, especially if carried out immediately in the very same deposition system, will not introduce additional defects and may be coupled with high and controlled n-type doping which is not available in a silane-based system.
    Type: Grant
    Filed: April 30, 1993
    Date of Patent: January 3, 1995
    Assignee: International Business Machines Corporation
    Inventors: Paul D. Agnello, Detlev A. Gruetzmacher, Tung-Sheng Kuan, Thomas O. Sedgwick
  • Patent number: 5227330
    Abstract: A system and method for growing low defect density epitaxial layers of Si on imperfectly cleaned Si surfaces by either selective or blanket deposition at low temperatures using the APCVD process wherein a first thin, e.g., 10 nm, layer of Si is grown on the surface from silane or disilane, followed by the growing of the remainder of the film from dichlorosilane (DCS) at the same low temperature, e.g., 550.degree. C. to 850.degree. C. The subsequent growth of the second layer with DCS over the first layer, especially if carried out immediately in the very same deposition system, will not introduce additional defects and may be coupled with high and controlled n-type doping which is not available in a silane-based system.
    Type: Grant
    Filed: October 31, 1991
    Date of Patent: July 13, 1993
    Assignee: International Business Machines Corporation
    Inventors: Paul D. Agnello, Tung-Sheng Kuan, Thomas O. Sedgwick
  • Patent number: 4316209
    Abstract: Methods and resulting structures for thermally stable metal/silicon contacts are described. The resulting contacts are aluminum which is alloyed with at least one noble metal from the group of Pd and Pt wherein at least one region of the contact is further alloyed with silicon.
    Type: Grant
    Filed: August 31, 1979
    Date of Patent: February 16, 1982
    Assignee: International Business Machines Corporation
    Inventors: Paul S. Ho, Uwe Koster, Tung-Sheng Kuan, Iwao Ohdomari, Arnold Reisman