Abstract: A flip-chip LED, a method for manufacturing the same and a flip-chip LED package are revealed. The LED includes at least one multi-layer reflective layer covered over the outermost layer thereof. The multi-layer reflective layer includes non-conductive reflective layer or combination of the non-conductive reflective layer with conductive reflective layer. The multi-layer reflective layer is manufactured by physical vapor deposition (PVD) with a mask at one time. The mask is used to form a pattern of the multi-layer reflective layer. Thus a photoresist layer is further formed on surface of exposed electrodes. Then a pumping and venting process is used only once during to complete vacuum deposition of each layer of the multi-layer reflective layer in turn.

Abstract: A flip-chip LED, a method for manufacturing the same and a flip-chip LED package are revealed. The LED includes at least one multi-layer reflective layer covered over the outermost layer thereof. The multi-layer reflective layer includes non-conductive reflective layer or combination of the non-conductive reflective layer with conductive reflective layer. The multi-layer reflective layer is manufactured by physical vapor deposition (PVD) with a mask at one time. The mask is used to form a pattern of the multi-layer reflective layer. Thus a photoresist layer is further formed on surface of exposed electrodes. Then a pumping and venting process is used only once during to complete vacuum deposition of each layer of the multi-layer reflective layer in turn.

Abstract: Electroless nickel bumps of die pads and a method thereof are disclosed. A protection layer is formed on the top surface and a surrounding sidewall of each electroless nickel bump in turn or at the same time by two separated processes or the same process. The two separated processes are selected from the group consisting of immersion gold and immersion silver. Thereby hardness of the top surface of the electroless nickel bump is improved and reduced. Moreover, easy oxidation of the surrounding sidewall of the electroless nickel bump and short circuit of the bump caused by electron migration can both be avoided.

Abstract: Two circuit layout areas on two surfaces of a chip are connected. Holes in the chip are coordinated with a conductive paste to connect the two surfaces. Thus, fabrication is made easy and cost is reduced.