Patents by Inventor Tung T. Lam

Tung T. Lam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods and systems for solid state heat transfer
    Patent number: 9885502
    Abstract: Various embodiments are directed to a thermoelectric device comprising a thermoelectric element, a first heat switch and a second heat switch. The thermoelectric element may comprise a first component in electrical contact with a second component at an interface. The first component may comprise a first material and the second component may comprise a second material different from the first material. The first heat switch may comprise a first terminal in thermal contact with the interface and a second terminal in thermal contact with a thermal reservoir. The second heat switch may comprise a first terminal in thermal contact with the interface and a second terminal in thermal contact with a thermal load.
    Type: Grant
    Filed: November 7, 2014
    Date of Patent: February 6, 2018
    Assignee: The Aerospace Corporation
    Inventors: Sidney W. K. Yuan, Tung T. Lam
  • METHODS AND SYSTEMS FOR SOLID STATE HEAT TRANSFER
    Publication number: 20160169564
    Abstract: Various embodiments are directed to a thermoelectric device comprising a thermoelectric element, a first heat switch and a second heat switch. The thermoelectric element may comprise a first component in electrical contact with a second component at an interface. The first component may comprise a first material and the second component may comprise a second material different from the first material. The first heat switch may comprise a first terminal in thermal contact with the interface and a second terminal in thermal contact with a thermal reservoir. The second heat switch may comprise a first terminal in thermal contact with the interface and a second terminal in thermal contact with a thermal load.
    Type: Application
    Filed: November 7, 2014
    Publication date: June 16, 2016
    Inventors: Sidney W. K. Yuan, Tung T. Lam
  • Methods and systems for solid state heat transfer
    Patent number: 8904809
    Abstract: Various embodiments are directed to a thermoelectric device comprising a thermoelectric element, a first heat switch and a second heat switch. The thermoelectric element may comprise a first component in electrical contact with a second component at an interface. The first component may comprise a first material and the second component may comprise a second material different from the first material. The first heat switch may comprise a first terminal in thermal contact with the interface and a second terminal in thermal contact with a thermal reservoir. The second heat switch may comprise a first terminal in thermal contact with the interface and a second terminal in thermal contact with a thermal load.
    Type: Grant
    Filed: March 17, 2011
    Date of Patent: December 9, 2014
    Assignee: The Aerospace Corporation
    Inventors: Sidney W. K. Yuan, Tung T. Lam
  • METHODS AND SYSTEMS FOR SOLID STATE HEAT TRANSFER
    Publication number: 20120234526
    Abstract: Various embodiments are directed to a thermoelectric device comprising a thermoelectric element, a first heat switch and a second heat switch. The thermoelectric element may comprise a first component in electrical contact with a second component at an interface. The first component may comprise a first material and the second component may comprise a second material different from the first material. The first heat switch may comprise a first terminal in thermal contact with the interface and a second terminal in thermal contact with a thermal reservoir. The second heat switch may comprise a first terminal in thermal contact with the interface and a second terminal in thermal contact with a thermal load.
    Type: Application
    Filed: March 17, 2011
    Publication date: September 20, 2012
    Applicant: The Aerospace Corporation
    Inventors: Sidney W. K. Yuan, Tung T. Lam