Abstract: A temperature sensing device includes a substrate, a first reflective module, a first window cover, and a dual thermopile sensor. The first reflective module is disposed on the substrate, including a first mirror chamber with a narrow field of view (FOV), and the first reflective module focuses a thermal radiation from measured object to a first image plane in the first mirror chamber. The first window cover is disposed on the first reflective module, and the first window cover allows a selected band of the thermal radiation to pass through. The dual thermopile sensor is disposed on the substrate and located in the first mirror chamber, and the dual thermopile sensor senses a temperature data from the first image plane. Additional second reflective module, LED source plus pin hole with same FOV of dual thermopile sensor can illuminate the measured object for ease of placement of object to be heated.

Abstract: An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. To measure object temperature accurately under acute change in environmental temperature, this disclosure uses the duo-thermopile sensing elements, that one is the active unit for measuring the object temperature and another one is the dummy unit for compensating the effect from the package structure.

Abstract: A temperature sensing device includes a substrate, a first reflective module, a first window cover, and a dual thermopile sensor. The first reflective module is disposed on the substrate, including a first mirror chamber with a narrow field of view (FOV), and the first reflective module focuses a thermal radiation from measured object to a first image plane in the first mirror chamber. The first window cover is disposed on the first reflective module, and the first window cover allows a selected band of the thermal radiation to pass through. The dual thermopile sensor is disposed on the substrate and located in the first mirror chamber, and the dual thermopile sensor senses a temperature data from the first image plane. Additional second reflective module, LED source plus pin hole with same FOV of dual thermopile sensor can illuminate the measured object for ease of placement of object to be heated.

Abstract: A temperature sensing device includes a substrate, a first reflective module, a first window cover, and a dual thermopile sensor. The first reflective module is disposed on the substrate, including a first mirror chamber with a narrow field of view (FOV), and the first reflective module focuses a thermal radiation from measured object to a first image plane in the first mirror chamber. The first window cover is disposed on the first reflective module, and the first window cover allows a selected band of the thermal radiation to pass through. The dual thermopile sensor is disposed on the substrate and located in the first mirror chamber, and the dual thermopile sensor senses a temperature data from the first image plane. Additional second reflective module, LED source plus pin hole with same FOV of dual thermopile sensor can illuminate the measured object for ease of placement of object to be heated.

Abstract: An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. The conversion from wrist temperature to body core temperature uses detected ambient temperature and fixed humidity or imported humidity level to calculate the body core temperature based on experimental data and curve fitting. The skin temperature compensation can be set differently for different sex gender, different standard deviation of wrist temperature and external relative humidity reading.

Abstract: A supplementary mechanism that provides a temperature rise and fall effect to a machine tool spindle is mainly used to connect to pipelines between a machine tool spindle and a cooling device. The present invention provides an additional heating function to the spindle of the machine tool that originally has a cooling device, and still retains its original cooling function. The supplementary mechanism can provide the effect of raising and lowering the temperature. When cooling, the liquid provided by the cooling device is passed to directly cool the machine tool spindle. When raising the temperature, the flow path is switched, so that the liquid of the cooling device cannot flow to the machine tool spindle, and the liquid flowing out of the machine tool spindle forms an independent circulation channel, and the supplementary mechanism heats the liquid in the independent circulation channel, achieving the effect of rapid heating.

Abstract: An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. The conversion from wrist temperature to body core temperature uses detected ambient temperature and fixed humidity or imported humidity level to calculate the body core temperature based on experimental data and curve fitting. The skin temperature compensation can be set differently for different sex gender, different standard deviation of wrist temperature and external relative humidity reading.

Abstract: An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. To measure object temperature accurately under acute change in environmental temperature, this disclosure uses the duo-thermopile sensing elements, that one is the active unit for measuring the object temperature and another one is the dummy unit for compensating the effect from the package structure.

Abstract: A thermal sensor package for earbuds includes two thermopile sensor elements on a single thermopile sensor chip, and the two thermopile sensor elements are separated by a block wall of a cap. One of the thermopile sensor elements senses external infrared thermal radiation through a window of the cap, and the other thermopile sensor element senses internal infrared thermal radiation from a package structure as a basis for correcting compensation. Therefore, the foregoing thermal sensor package for earbuds can quickly correct a measurement error caused by the package structure to improve the measurement accuracy. In addition, the forgoing thermal sensor package for earbuds has a simple packaging step and is easy to arrange a silicon based infrared lens to expand its application.

Abstract: A supplementary mechanism that provides a temperature rise and fall effect to a machine tool spindle is mainly used to connect to pipelines between a machine tool spindle and a cooling device. The present invention provides an additional heating function to the spindle of the machine tool that originally has a cooling device, and still retains its original cooling function. The supplementary mechanism can provide the effect of raising and lowering the temperature. When cooling, the liquid provided by the cooling device is passed to directly cool the machine tool spindle. When raising the temperature, the flow path is switched, so that the liquid of the cooling device cannot flow to the machine tool spindle, and the liquid flowing out of the machine tool spindle forms an independent circulation channel, and the supplementary mechanism heats the liquid in the independent circulation channel, achieving the effect of rapid heating.

Abstract: A thermal sensor package for earbuds includes two thermopile sensor elements on a single thermopile sensor chip, and the two thermopile sensor elements are separated by a block wall of a cap. One of the thermopile sensor elements senses external infrared thermal radiation through a window of the cap, and the other thermopile sensor element senses internal infrared thermal radiation from a package structure as a basis for correcting compensation. Therefore, the foregoing thermal sensor package for earbuds can quickly correct a measurement error caused by the package structure to improve the measurement accuracy. In addition, the forgoing thermal sensor package for earbuds has a simple packaging step and is easy to arrange a silicon based infrared lens to expand its application.

Abstract: An expandable keyboard device for use in connection with an electronic device includes a keyboard module having a keyboard housing, a pivot unit connected to the keyboard housing, and a clamping mechanism including a mounting seat connected to the pivot unit and rotatable relative to the keyboard module, and at least one clamping arm cooperating with the mounting seat to define a receiving slot for receiving the electronic device. The clamping arm is movable relative to the mounting seat for clamping the electronic device.

Abstract: An expandable keyboard device for use in connection with an electronic device includes a keyboard module having a keyboard housing, a pivot unit connected to the keyboard housing, and a clamping mechanism including a mounting seat connected to the pivot unit and rotatable relative to the keyboard module, and at least one clamping arm cooperating with the mounting seat to define a receiving slot for receiving the electronic device. The clamping arm is movable relative to the mounting seat for clamping the electronic device.

Abstract: A wireless image transmitting apparatus includes an image processing unit, a wireless bridging module, and a wireless local area network module. The wireless bridging module includes a network switch and a network port. The network switch is in signal communication with the network port and the image processing unit. The WLAN module is in signal communication with the network switch. The WLAN module uses a first type of packet and a first band to transmit a signal from the image processing unit and uses a second type of packet and a second band to transmit a signal from the network port. A method for transmitting data in a wireless image transmitting apparatus is also disclosed.