Abstract: The disclosure provides a liquid-cooling heat dissipation device. The liquid-cooling heat dissipation device is configured to be in thermal contact with an expansion card. The liquid-cooling heat dissipation device includes a base plate, a thermally-conductive component and a heat exchanger. The base plate is configured to be mounted on the expansion card. The thermally-conductive component is mounted on the base plate. The thermally-conductive component and the base plate together form a liquid chamber therebetween. The heat exchanger is mounted on the base plate and connected to the liquid chamber.

Abstract: The disclosure provides a liquid-cooling heat dissipation device. The liquid-cooling heat dissipation device is configured to be in thermal contact with an expansion card. The liquid-cooling heat dissipation device includes a base plate, a thermally-conductive component and a heat exchanger. The base plate is configured to be mounted on the expansion card. The thermally-conductive component is mounted on the base plate. The thermally-conductive component and the base plate together form a liquid chamber therebetween. The heat exchanger is mounted on the base plate and connected to the liquid chamber.

Abstract: A heat dissipating device includes a heat dissipating fin and a heat pipe. The heat dissipating fin includes a fin body, a through hole, a first arc-shaped portion and a second arc-shaped portion. The through hole is formed on the fin body and has a central line. The first arc-shaped portion extends from the through hole in a first direction and the second arc-shaped portion extends from the through hole in a second direction, wherein the first direction is opposite to the second direction. The first arc-shaped portion and the second arc-shaped portion are located at opposite sides of the central line. The heat pipe is disposed in the through hole.

Abstract: A heat sink assembly includes a fin module, heat pipes, and a pair of side plates. The fin module is composed of a plurality of fins and has a flat side formed with a trough and two recesses. Each of the heat pipes has an evaporation section. The evaporation sections are parallelly accommodated in the trough and in contact with each other. The side plates are separately fixed in the recesses and protrude from the flat side. The evaporation sections are formed with a flat surface coplanar with the side plates. By this arrangement, the thermal contact area between the heat pipes and a heat source is increased to thereby improve the heat-dissipating efficiency of the heat sink assembly.

Abstract: The present invention relates to a heat sink having juxtaposed heat pipes and a method for manufacturing the same. The heat sink includes a base, a plurality of heat pipes and a pair of side strips. The base has a surface on which an open trough and an insertion trough on both sides of the open trough are provided. Each heat pipe has an evaporating section. The evaporating sections are juxtaposed in the open trough and adhered to each other. Each evaporating section has a planar surface. The side strips are fixed into the insertion troughs and protrude from the surface of the base. The planar surface of each evaporating section and the outer surface of each side strip are coplanar. By this structure, the thermal contact surface between the heat pipes and electronic heat-generating sources is increased, so that the heat-dissipating efficiency of the heat sink is improved.