Patents by Inventor Tung-Yu Chang

Tung-Yu Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board and method for fabricating the same
    Patent number: 8420954
    Abstract: The invention provides a printed circuit board and a method for fabricating the same. The printed circuit board includes a core substrate having a first surface and an opposite second surface. A first through hole and a second through hole are formed through a portion of the core substrate, respectively from the first surface and second surfaces, wherein the first and second through holes are laminated vertically and connect to each other. A first guide rail and a second guide rail are, respectively, formed through a portion of the core substrate and connected to the second through hole, so that a fluid flows sequentially from an outside of the printed circuit board through the first guide rail, the second through hole and the second guide rail, to the outside of the printed circuit board.
    Type: Grant
    Filed: November 30, 2010
    Date of Patent: April 16, 2013
    Assignee: Nan Ya PCB Corp.
    Inventors: Hsien-Chieh Lin, Tung-Yu Chang
  • PRINTED CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME
    Publication number: 20120043127
    Abstract: The invention provides a printed circuit board and a method for fabricating the same. The printed circuit board includes a core substrate having a first surface and an opposite second surface. A first through hole and a second through hole are formed through a portion of the core substrate, respectively from the first surface and second surfaces, wherein the first and second through holes are laminated vertically and connect to each other. A first guide rail and a second guide rail are, respectively, formed through a portion of the core substrate and connected to the second through hole, so that a fluid flows sequentially from an outside of the printed circuit board through the first guide rail, the second through hole and the second guide rail, to the outside of the printed circuit board.
    Type: Application
    Filed: November 30, 2010
    Publication date: February 23, 2012
    Applicant: NAN YA PCB CORP.
    Inventors: Hsien-Chieh LIN, Tung-Yu Chang