Abstract: Three bonding materials are provided on a first plate. The first bonding material is located between the second and third bonding materials. The first bonding material is thicker than the other bonding materials. A second plate is provided on the first bonding material. All of the plates and the bonding materials are heated to the softening point of the first bonding material. A load is exerted on the first bonding material to reduce the thickness of the first bonding material to that of the second and third bonding materials and transfer the load to the second and third bonding materials from the first bonding material. The temperature is raised to and kept at the crystallization point of the first bonding material. The temperature is raised to the wetting point of the second and third bonding materials.

Abstract: Glass-ceramic sealant is disclosed for planar solid oxide fuel cells. The glass-ceramic sealant includes 0 to 40 mol % of silicon oxide, 0 to 15 mol % boron oxide, 0 to 10 mol % of aluminum oxide, 0 to 40 mol % of barium oxide, 0 to 15 mol % of calcium oxide, 0 to 15 mol % of lanthanum oxide and 0 to 5 mol % of zirconium dioxide. At 0° C. to 600° C., the thermal expansion coefficient of the sealant is 8 to 10 ppm/° C.

Abstract: An apparatus is disclosed for testing the performance of a sealant for solid oxide fuel cell packs. The apparatus includes an oven including a base, a platform provided on the base and a frame connected to the platform. An elevator is used to raise and lower the oven. A pressuring and testing chamber is provided on the platform. The pressuring and testing chamber includes a first body and a second body connected to the first body. A carrier is provided between the first and second bodies. The carrier includes a first plate and a second plate so that the sealant can be provided between the first and second plates. A pusher includes an end connected to the frame and another end for pushing the second plate. A pusher-driving unit is connected to the frame for raising and lowering the pusher.

Abstract: An apparatus is disclosed for testing the performance of a sealant for solid oxide fuel cell packs. The apparatus includes an oven including a base, a platform provided on the base and a frame connected to the platform. An elevator is used to raise and lower the oven. A pressuring and testing chamber is provided on the platform. The pressuring and testing chamber includes a first body and a second body connected to the first body. A carrier is provided between the first and second bodies. The carrier includes a first plate and a second plate so that the sealant can be provided between the first and second plates. A pusher includes an end connected to the frame and another end for pushing the second plate. A pusher-driving unit is connected to the frame for raising and lowering the pusher.

Abstract: Glass-ceramic sealant is disclosed for planar solid oxide fuel cells. The glass-ceramic sealant includes 0 to 40 mol % of silicon oxide, 0 to 15 mol % boron oxide, 0 to 10 mol % of aluminum oxide, 0 to 40 mol % of barium oxide, 0 to 15 mol % of calcium oxide, 0 to 15 mol % of lanthanum oxide and 0 to 5 mol % of zirconium dioxide. At 0° C. to 600° C., the thermal expansion coefficient of the sealant is 8 to 10 ppm/° C.

Abstract: Three bonding materials are provided on a first plate. The first bonding material is located between the second and third bonding materials. The first bonding material is thicker than the other bonding materials. A second plate is provided on the first bonding material. All of the plates and the bonding materials are heated to the softening point of the first bonding material. A load is exerted on the first bonding material to reduce the thickness of the first bonding material to that of the second and third bonding materials and transfer the load to the second and third bonding materials from the first bonding material. The temperature is raised to and kept at the crystallization point of the first bonding material. The temperature is raised to the wetting point of the second and third bonding materials.