Patents by Inventor Tung-Zung Wu

Tung-Zung Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for cutting printed circuit board
    Patent number: 7482250
    Abstract: A method for cutting a printed circuit board includes providing a printed circuit board including a cutting region having a plurality of metal conducting wires, disposing a patterned first protection layer on the printed circuit board surface and exposing the metal conducting wires in the cutting region, forming a conducting layer on a surface of the metal conducting wires, disposing a second protection layer on the cutting region, performing a cutting process in the cutting region, and removing the second protection layer.
    Type: Grant
    Filed: August 24, 2005
    Date of Patent: January 27, 2009
    Assignee: Nan Ya Printed Circuit Board Corporation
    Inventors: Tung-Zung Wu, Kuo-Feng Yang, Chun-Chieh Huang
  • Method for Cutting Printed Circuit Board
    Publication number: 20060134888
    Abstract: A method for cutting a printed circuit board includes providing a printed circuit board including a cutting region having a plurality of metal conducting wires, disposing a patterned first protection layer on the printed circuit board surface and exposing the metal conducting wires in the cutting region, forming a conducting layer on a surface of the metal conducting wires, disposing a second protection layer on the cutting region, performing a cutting process in the cutting region, and removing the second protection layer.
    Type: Application
    Filed: August 24, 2005
    Publication date: June 22, 2006
    Inventors: Tung-Zung Wu, Kuo-Feng Yang, Chun-Chieh Huang