Patents by Inventor Tuomas Waris
Tuomas Waris has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10231335Abstract: The present invention generally provides a novel method for manufacturing an electronic module with crossed conducting lines and a novel electronic module with crossed conducting lines. In particular, an aspect of the present invention is to provide a thin, single layer electronic module. It is also an object of the present invention to provide an electronic module with an embedded jumper element having reliable high quality connections and contacts. To achieve at least some of the aspects of the present invention, an embedded pre-fabricated jumper module is placed inside a printed circuit board which allows the crossing of conducting lines within the module without manufacturing additional layers over the whole PCB board. The resultant PCB will have improved contacts and will not have surface deformation.Type: GrantFiled: May 23, 2014Date of Patent: March 12, 2019Assignee: GE Embedded Electronics OyInventors: Petteri Palm, Tuomas Waris, Antti Iihola
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Patent number: 9820375Abstract: Rigid-flex-type circuit-board structure and manufacturing method, in which a flexible membrane and a sacrificial-material piece are attached to an insulator membrane in the location of the flexible zone. An insulator layer, which encloses within itself a sacrificial-material piece is manufactured on the surface of the conductor membrane. The flexible zone is formed in such a way that an opening is made in the insulator layer, through which the sacrificial-material piece is removed. The flexible zone comprises at least part of the flexible membrane as well as conductors, which are manufactured by patterning the insulator membrane at a suitable stage in the method.Type: GrantFiled: January 17, 2017Date of Patent: November 14, 2017Assignee: GE Embedded Electronics OyInventors: Antti Iihola, Tuomas Waris
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Patent number: 9674948Abstract: Rigid-flex-type circuit-board structure and manufacturing method, in which a flexible membrane and a sacrificial-material piece are attached to an insulator membrane in the location of the flexible zone. An insulator layer, which encloses within itself a sacrificial-material piece is manufactured on the surface of the conductor membrane. The flexible zone is formed in such a way that an opening is made in the insulator layer, through which the sacrificial-material piece is removed. The flexible zone comprises at least part of the flexible membrane as well as conductors, which are manufactured by patterning the insulator membrane at a suitable stage in the method.Type: GrantFiled: July 15, 2016Date of Patent: June 6, 2017Assignee: GE Embedded Electronics OyInventors: Antti Iihola, Tuomas Waris
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Publication number: 20170127508Abstract: Rigid-flex-type circuit-board structure and manufacturing method, in which a flexible membrane and a sacrificial-material piece are attached to an insulator membrane in the location of the flexible zone. An insulator layer, which encloses within itself a sacrificial-material piece is manufactured on the surface of the conductor membrane. The flexible zone is formed in such a way that an opening is made in the insulator layer, through which the sacrificial-material piece is removed. The flexible zone comprises at least part of the flexible membrane as well as conductors, which are manufactured by patterning the insulator membrane at a suitable stage in the method.Type: ApplicationFiled: January 17, 2017Publication date: May 4, 2017Inventors: Antti Iihola, Tuomas Waris
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Publication number: 20160330830Abstract: Rigid-flex-type circuit-board structure and manufacturing method, in which a flexible membrane and a sacrificial-material piece are attached to an insulator membrane in the location of the flexible zone. An insulator layer, which encloses within itself a sacrificial-material piece is manufactured on the surface of the conductor membrane. The flexible zone is formed in such a way that an opening is made in the insulator layer, through which the sacrificial-material piece is removed. The flexible zone comprises at least part of the flexible membrane as well as conductors, which are manufactured by patterning the insulator membrane at a suitable stage in the method.Type: ApplicationFiled: July 15, 2016Publication date: November 10, 2016Applicant: GE Embedded Electronics OyInventors: Antti Iihola, Tuomas Waris
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Patent number: 9425158Abstract: Rigid-flex-type circuit-board structure and manufacturing method, in which a flexible membrane (20) and a sacrificial-material piece (16) are attached to an insulator membrane (12) in the location of the flexible zone (13). An insulator layer (1), which encloses within itself a sacrificial-material piece (16) is manufactured on the surface of the conductor membrane (12). The flexible zone (13) is formed in such a way that an opening (9) is made in the insulator layer (1), through which the sacrificial-material piece (16) is removed. The flexible zone comprises at least part of the flexible membrane (20) as well as conductors (22), which are manufactured by patterning the insulator membrane (12) at a suitable stage in the method.Type: GrantFiled: January 5, 2010Date of Patent: August 23, 2016Assignee: GE Embedded Electronics OyInventors: Antti Iihola, Tuomas Waris
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Publication number: 20140254107Abstract: The present invention generally provides a novel method for manufacturing an electronic module with crossed conducting lines and a novel electronic module with crossed conducting lines. In particular, an aspect of the present invention is to provide a thin, single layer electronic module. It is also an object of the present invention to provide an electronic module with an embedded jumper element having reliable high quality connections and contacts. To achieve at least some of the aspects of the present invention, an embedded pre-fabricated jumper module is placed inside a printed circuit board which allows the crossing of conducting lines within the module without manufacturing additional layers over the whole PCB board. The resultant PCB will have improved contacts and will not have surface deformation.Type: ApplicationFiled: May 23, 2014Publication date: September 11, 2014Applicant: GE EMBEDDED ELECTRONICS OYInventors: Petteri Palm, Tuomas Waris, Antti Iihola
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Patent number: 8735735Abstract: The present invention generally provides a novel method for manufacturing an electronic module with crossed conducting lines and a novel electronic module with crossed conducting lines. In particular, an aspect of the present invention is to provide a thin, single layer electronic module. It is also an object of the present invention to provide an electronic module with an embedded jumper element having reliable high quality connections and contacts. To achieve at least some of the aspects of the present invention, an embedded pre-fabricated jumper module is placed inside a printed circuit board which allows the crossing of conducting lines within the module without manufacturing additional layers over the whole PCB board. The resultant PCB will have improved contacts and will not have surface deformation.Type: GrantFiled: July 23, 2010Date of Patent: May 27, 2014Assignee: GE Embedded Electronics OyInventors: Petteri Palm, Tuomas Waris, Antti Iihola
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Patent number: 8631566Abstract: A method for manufacturing a circuit board structure comprising at least one electrical component. The method comprises the steps of fabricating a conductive pattern on the surface of an essentially plane-like layer on the back side of the plane-like layer, and forming an electrical contact between the at least one electrical component and the conductive pattern.Type: GrantFiled: August 24, 2009Date of Patent: January 21, 2014Assignee: Imbera Electronics OyInventors: Petteri Palm, Tuomas Waris
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Publication number: 20120018203Abstract: The present invention generally provides a novel method for manufacturing an electronic module with crossed conducting lines and a novel electronic module with crossed conducting lines. In particular, an aspect of the present invention is to provide a thin, single layer electronic module. It is also an object of the present invention to provide an electronic module with an embedded jumper element having reliable high quality connections and contacts. To achieve at least some of the aspects of the present invention, an embedded pre-fabricated jumper module is placed inside a printed circuit board which allows the crossing of conducting lines within the module without manufacturing additional layers over the whole PCB board. The resultant PCB will have improved contacts and will not have surface deformation.Type: ApplicationFiled: July 23, 2010Publication date: January 26, 2012Applicant: IMBERA ELECTRONICS OYInventors: Petteri Palm, Tuomas Waris, Antti Iihola
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Publication number: 20100170703Abstract: Rigid-flex-type circuit-board structure and manufacturing method, in which a flexible membrane (20) and a sacrificial-material piece (16) are attached to an insulator membrane (12) in the location of the flexible zone (13). An insulator layer (1), which encloses within itself a sacrificial-material piece (16) is manufactured on the surface of the conductor membrane (12). The flexible zone (13) is formed in such a way that an opening (9) is made in the insulator layer (1), through which the sacrificial-material piece (16) is removed. The flexible zone comprises at least part of the flexible membrane (20) as well as conductors (22), which are manufactured by patterning the insulator membrane (12) at a suitable stage in the method.Type: ApplicationFiled: January 5, 2010Publication date: July 8, 2010Applicant: IMBERA ELECTRONICS OYInventors: Antti IIHOLA, Tuomas WARIS
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Publication number: 20100046186Abstract: A circuit board structure and a method for manufacturing a circuit board structure comprising an electrical component. The method comprises the steps of fabricating a conductive pattern on the surface of an essentially plane-like layer on the back side of the plane-like layer, and forming an electrical contact between at least one electrical component and the conductive pattern.Type: ApplicationFiled: August 24, 2009Publication date: February 25, 2010Applicant: Imbera Electronics OyInventors: Petteri Palm, Tuomas Waris