Abstract: Provided is a multi-channel light-receiving module, which comprises an incident collimator, a light-splitting assembly, an optical path conversion assembly and a photoelectric chip array which are arranged in sequence, wherein the light-splitting assembly comprises an inner reflector and a plurality of optical filters, and the optical filters are respectively arranged on an output end of the inner reflector; the channel interval of photoelectric chips in the photoelectric chip array is less than the channel interval of an adjacent optical filter; the optical path conversion assembly comprises a plurality of emergent collimators and an optical fiber connected to each of the emergent collimators; a plurality of paths of optical signals output by the light-splitting assembly are respectively coupled into corresponding optical fibers after passing through the plurality of emergent collimators; and the plurality of paths of optical signals are output by output ends of the plurality of optical fibers and are then c

Abstract: Provided is a multi-channel light-receiving module, which comprises an incident collimator, a light-splitting assembly, an optical path conversion assembly and a photoelectric chip array which are arranged in sequence, wherein the light-splitting assembly comprises an inner reflector and a plurality of optical filters, and the optical filters are respectively arranged on an output end of the inner reflector; the channel interval of photoelectric chips in the photoelectric chip array is less than the channel interval of an adjacent optical filter; the optical path conversion assembly comprises a plurality of emergent collimators and an optical fiber connected to each of the emergent collimators; a plurality of paths of optical signals output by the light-splitting assembly are respectively coupled into corresponding optical fibers after passing through the plurality of emergent collimators; and the plurality of paths of optical signals are output by output ends of the plurality of optical fibers and are then c

Abstract: The present invention applies to the technical field of photoelectric detectors and provides a high-frequency photoelectric detector encapsulation base can-packaged by using a multi-layer ceramic, comprising a laminated multi-layer ceramic substrate, wherein the multi-layer ceramic substrate is welded with pins at a bottom and provided with a metal ring at a top; an upper surface and a lower surface of each layer of the ceramic substrate are both plated with a conductive metal layer; circuit connection holes are distributed in each layer of the ceramic substrate; the upper surface of the multi-layer ceramic substrate is provided with two power contacts and two differential signal contacts; and the power contacts and the differential signal contacts penetrate through each layer of the ceramic substrate to be connected to the corresponding pins.

Abstract: The present invention applies to the technical field of photoelectric detectors and provides a high-frequency photoelectric detector encapsulation base can-packaged by using a multi-layer ceramic, comprising a laminated multi-layer ceramic substrate, wherein the multi-layer ceramic substrate is welded with pins at a bottom and provided with a metal ring at a top; an upper surface and a lower surface of each layer of the ceramic substrate are both plated with a conductive metal layer; circuit connection holes are distributed in each layer of the ceramic substrate; the upper surface of the multi-layer ceramic substrate is provided with two power contacts and two differential signal contacts; and the power contacts and the differential signal contacts penetrate through each layer of the ceramic substrate to be connected to the corresponding pins.