Patents by Inventor Turki bin Saud bin Mohammed Al-Saud

Turki bin Saud bin Mohammed Al-Saud has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patterned metallization handle layer for controlled spalling
    Patent number: 9918382
    Abstract: A handle substrate having at least one metallization region is provided on a stressor layer that is located above a base substrate such that the at least one metallization region is in contact with a surface of the stressor layer. An upper portion of the base substrate is spalled, i.e., removed, to provide a structure comprising, from bottom to top, a spalled material portion of the base substrate, the stressor layer and the handle substrate containing the at least one metallization region in contact with the surface of the stressor layer.
    Type: Grant
    Filed: July 11, 2017
    Date of Patent: March 13, 2018
    Assignees: International Business Machines Corporation, KING ABDULAZIZ CITY FOR SCIENCE AND TECHNOLOGY
    Inventors: Turki bin Saud bin Mohammed Al-Saud, Stephen W. Bedell, Keith E. Fogel, Paul A. Lauro, Devendra K. Sadana
  • PATTERNED METALLIZATION HANDLE LAYER FOR CONTROLLED SPALLING
    Publication number: 20170311436
    Abstract: A handle substrate having at least one metallization region is provided on a stressor layer that is located above a base substrate such that the at least one metallization region is in contact with a surface of the stressor layer. An upper portion of the base substrate is spalled, i.e., removed, to provide a structure comprising, from bottom to top, a spalled material portion of the base substrate, the stressor layer and the handle substrate containing the at least one metallization region in contact with the surface of the stressor layer.
    Type: Application
    Filed: July 11, 2017
    Publication date: October 26, 2017
    Inventors: Turki bin Saud bin Mohammed Al-Saud, Stephen W. Bedell, Keith E. Fogel, Paul A. Lauro, Devendra K. Sadana
  • Patterned metallization handle layer for controlled spalling
    Patent number: 9713250
    Abstract: A handle substrate having at least one metallization region is provided on a stressor layer that is located above a base substrate such that the at least one metallization region is in contact with a surface of the stressor layer. An upper portion of the base substrate is spalled, i.e., removed, to provide a structure comprising, from bottom to top, a spalled material portion of the base substrate, the stressor layer and the handle substrate containing the at least one metallization region in contact with the surface of the stressor layer.
    Type: Grant
    Filed: October 7, 2015
    Date of Patent: July 18, 2017
    Assignees: International Business Machines Corporation, KING ABDULAZIZ CITY FOR SCIENCE AND TECHNOLOGY
    Inventors: Turki bin Saud bin Mohammed Al-Saud, Stephen W. Bedell, Keith E. Fogel, Paul A. Lauro, Devendra K. Sadana
  • Patterned metallization handle layer for controlled spalling
    Patent number: 9578736
    Abstract: A handle substrate having at least one metallization region is provided on a stressor layer that is located above a base substrate such that the at least one metallization region is in contact with a surface of the stressor layer. An upper portion of the base substrate is spalled, i.e., removed, to provide a structure comprising, from bottom to top, a spalled material portion of the base substrate, the stressor layer and the handle substrate containing the at least one metallization region in contact with the surface of the stressor layer.
    Type: Grant
    Filed: December 23, 2014
    Date of Patent: February 21, 2017
    Assignees: International Business Machines Corporation, King Abdulaziz City for Science and Technology
    Inventors: Turki bin Saud bin Mohammed Al-Saud, Stephen W. Bedell, Keith E. Fogel, Paul A. Lauro, Devendra K. Sadana
  • PATTERNED METALLIZATION HANDLE LAYER FOR CONTROLLED SPALLING
    Publication number: 20160183362
    Abstract: A handle substrate having at least one metallization region is provided on a stressor layer that is located above a base substrate such that the at least one metallization region is in contact with a surface of the stressor layer. An upper portion of the base substrate is spalled, i.e., removed, to provide a structure comprising, from bottom to top, a spalled material portion of the base substrate, the stressor layer and the handle substrate containing the at least one metallization region in contact with the surface of the stressor layer.
    Type: Application
    Filed: October 7, 2015
    Publication date: June 23, 2016
    Inventors: Turki bin Saud bin Mohammed Al-Saud, Stephen W. Bedell, Keith E. Fogel, Paul A. Lauro, Devendra K. Sadana
  • PATTERNED METALLIZATION HANDLE LAYER FOR CONTROLLED SPALLING
    Publication number: 20160183358
    Abstract: A handle substrate having at least one metallization region is provided on a stressor layer that is located above a base substrate such that the at least one metallization region is in contact with a surface of the stressor layer. An upper portion of the base substrate is spalled, i.e., removed, to provide a structure comprising, from bottom to top, a spalled material portion of the base substrate, the stressor layer and the handle substrate containing the at least one metallization region in contact with the surface of the stressor layer.
    Type: Application
    Filed: December 23, 2014
    Publication date: June 23, 2016
    Inventors: Turki bin Saud bin Mohammed Al-Saud, Stephen W. Bedell, Keith E. Fogel, Paul A. Lauro, Devendra K. Sadana