Abstract: Various methods and apparatuses are described in which an integrated circuit is organized into rows and columns of macro cells having a layout architecture that includes at least two metal layers and a plurality of traces carrying three or more different potentials of voltage routed by the metal layers. A first, a second, and a third adjacent metal layers extend across the integrated circuit. The plurality of traces carry three or more different potentials of voltage and are routed in the metal layers. A first power trace supplies a VDD voltage potential. A second power trace supplies a VSS voltage potential. A third power trace supplies a third voltage potential to support sleep modes and retain data during sleep modes. All three power supply traces connect to one or more transistors in a first macro cell.

Abstract: Various methods and apparatuses are described in which an integrated circuit is organized into rows and columns of macro cells having a layout architecture that includes at least two metal layers and a plurality of traces carrying three or more different potentials of voltage routed by the metal layers. A first, a second, and a third adjacent metal layers extend across the integrated circuit. The first metal layer may be located between the second metal layer and the layer of the macro cells. The second metal layer may be located between the third metal layer and the first metal layer. The third metal layer may be orientated orthogonal to the second metal layer. The plurality of traces carry three or more different potentials of voltage and are routed in the metal layers. A first power trace supplies a VDD voltage potential. A second power trace supplies a VSS voltage potential. A third power trace supplies a third voltage potential.

Abstract: Field programmable circuits and redundant logic are added to the substrate of a hybrid circuit with functionality to bypass and/or repair unusable dies in order to enhance yield and lower costs of manufacture. In a preferred embodiment, a collar of programmable logic is inserted between the functional component on the hybrid die and its I/O terminals. The programmable logic collar can be programmed after hybrid assembly and test in order to correct assembly errors or die failures through one or more of the following actions: switch between redundant functional units and I/Os on the hybrid die; switch between redundant IC dies on the substrate, invert signal polarity; correct crosstalk errors; perform test and fault isolation.

Abstract: A multiplayer game is disclosed consisting of a board with multiple home regions which are assigned to different players. Multiple sets of markers are provided, one for each player. Each set of marker is assigned a home region in which it can survive indefinitely, however, they can survive for only a limited number of turns outside of their respective home regions. Players advance their markers out of their home regions and into enemy regions and bring them back within said limited number of turns to score points, the number of steps a marker moves being determined by a number generating device. If the marker does not return back to its home region within the specified number of turns it dies and is removed from the board. The first player to score a necessary number of points wins the game.

Abstract: Individual elements of an integrated circuit such as storage elements, (for example, latch elements), can be selectively coupled to select lines and probe lines. During normal operation the latches are not connected to the select lines and behave as a normal latch. During a write/control test operation, the latch is connected to a select line and data placed on the select line is provided to an input of latch. Thereafter, the latch is placed into a latching state in response to the probe line and the clock signal, latching the data provided from the select line into latch. In order to read/observe data, the clock line and probe line are controlled to route data onto the associated select line. In one embodiment the probe line controls a transistor switch that connects the select line to the input of the latch. The probe line also controls a transmission gate which is placed in the latch to toggle the latch between a latching condition and a non-latching condition, in response to signals on the probe line.

Abstract: A storage element for testing delay paths in integrated circuits is described. The storage element may be used in integrated circuits having matrices of probe and sense lines. The storage element generates a logic transition on an input to a delay path, the logic transition being closely synchronized with a clock signal. The storage element comprises a data input and a data output coupled to the input to the delay path. A master latch receives data from the data input through a first switch, the first switch being controlled by the complement of the clock signal. A slave latch receives data from the master latch through a second switch, the second switch being controlled by the true of the clock signal. A first sense input loads a first logic state into the master latch through a third switch, the first sense input being coupled to one of the IC's sense lines. The third switch is controlled by one of the IC's probe lines.

Abstract: An integrated circuit structure which employs at least two metal levels overlying an array of circuit elements. Each metal level contains signal routing resources which can be used for supplying power and interconnecting circuit elements. The metal levels include a first metal level directly overlying the array of circuit elements, intermediate metal levels (if there are more than two metal levels), and a top metal level overlying all other metal levels. Power carrying tracks are disposed in the top metal level. Power antennae are disposed in the first metal level, but only where necessary to provide power to the circuit elements. The power antennae are for connecting the power carrying tracks to the circuit elements. Power bridges are disposed in intermediate metal levels between the first metal level and the top metal level. The power bridges are for connecting the power carrying tracks to the power antennae.

Abstract: During application of a sequence of design verification patterns at the primary input pins of a sequential circuit IC, a test vector is spliced between patterns to test for a fault condition. As design verification patterns are applied in sequence, the state of the sequential circuit changes. To test for a select fault condition, the sequential circuit needs to be in a desired state. While in such desired state, a test vector is applied and select internal circuit element responses are monitored. If the desired state occurs during a sequence of design verification patterns, then the test vector is applied between successive patterns before the IC clock has a transition. By applying the test signal, monitoring the response, then reapplying the design verification pattern before the clock changes, the IC subsequent state which would occur had the test vector been omitted still occurs.

Abstract: An IC has local test circuitry including a test point array, instruction register, data register, probe line drivers and control/sense line drivers/receivers. To test the IC, the instruction register is loaded initiating the test circuitry to address select test points to receive control signals and to address other select test points at which response signals are to be sensed. Control signals are produced from the data register contents. The data register contents are derived as a function of the prior contents of the data register and a bit pattern formed from response signals of select test points. According to one embodiment, the prior contents are exclusively or'ed with the bit pattern of response signals to derive the new data register contents. A continuous test is performed by using prior response signals exclusively OR'ed to data register contents so as to generate subsequent control signals. Predesigned test sequences enable fast continuous testing of the IC.