Patents by Inventor Tushar T. Shah

Tushar T. Shah has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for forming a micro column grid array (CGA)
    Patent number: 6547124
    Abstract: A method of forming a plurality of micro column interconnection structures on a semiconductor includes providing a semiconductor layer. A photoresist layer is formed on the semiconductor layer. A plurality of cavities are etched in the photoresist layer. The plurality of cavities extend through the photoresist layer to the semiconductor layer. Solder is deposited in the plurality of cavities, thereby forming a plurality of micro columns of solder.
    Type: Grant
    Filed: June 14, 2001
    Date of Patent: April 15, 2003
    Assignee: Bae Systems Information and Electronic Systems Integration Inc.
    Inventors: Tushar T. Shah, Andrew TS Pomerene, Keith K. Sturcken, Steven J. Wright
  • Insitu radiation protection of integrated circuits
    Patent number: 6544879
    Abstract: Methods for manufacturing microchips are provided. A plurality of alternating metallic wiring-layers and non-metallic layers, terminating with a metallic wiring-layer, are formed on a wafer. A plurality of vias is formed for electrically interconnecting various metallic wiring-layers. A plurality of electrically conducting pads is formed adjacent various vias. A passivation layer is formed adjacent the terminal metallic wiring-layer and the plurality of conducting pads. A portion of the passivation layer is removed to expose the plurality of conducting pads. A layer is formed adjacent the passivation layer and the plurality of exposed conducting pads for protecting the microchip against electromagnetic radiation. A portion of the protective layer is removed to expose the plurality of conducting pads. Each conducting pad is electrically isolated from the protective layer. An electrically conducting bump is formed on each conducting pad.
    Type: Grant
    Filed: August 22, 2002
    Date of Patent: April 8, 2003
    Assignee: Bae Systems Information & Electronic Systems Integration Inc.
    Inventors: Tushar T. Shah, Keith K. Sturcken, Steven Wright
  • Insitu radiation protection of integrated circuits
    Patent number: 6504256
    Abstract: A microchip having a passivation layer on an electrically active surface; a multitude of electrically conducting protuberances for electrically coupling the active surface to a substrate; a layer on the passivation layer for protecting against electromagnetic radiation; and a layer on an electrically inactive surface of the microchip for protecting against electromagnetic radiation.
    Type: Grant
    Filed: January 30, 2001
    Date of Patent: January 7, 2003
    Assignee: Bae Systems Information and Electronic Systems Integration, Inc.
    Inventors: Tushar T. Shah, Keith K. Sturcken, Steven Wright
  • Method for forming a micro column grid array (CGA)
    Publication number: 20020190107
    Abstract: A method of forming a plurality of micro column interconnection structures on a semiconductor includes providing a semiconductor layer. A photoresist layer is formed on the semiconductor layer. A plurality of cavities are etched in the photoresist layer. The plurality of cavities extend through the photoresist layer to the semiconductor layer. Solder is deposited in the plurality of cavities, thereby forming a plurality of micro columns of solder.
    Type: Application
    Filed: June 14, 2001
    Publication date: December 19, 2002
    Applicant: BAE SYSTEMS Information and Electronic Systems Integration, Inc.
    Inventors: Tushar T. Shah, Andrew TS Pomerene, Keith K. Sturcken, Steven J. Wright
  • Insitu radiation protection of integrated circuits
    Publication number: 20020100985
    Abstract: A microchip having a passivation layer on an electrically active surface; a multitude of electrically conducting protuberances for electrically coupling the active surface to a substrate; a layer on the passivation layer for protecting against electromagnetic radiation; and a layer on an electrically inactive surface of the microchip for protecting against electromagnetic radiation.
    Type: Application
    Filed: January 30, 2001
    Publication date: August 1, 2002
    Applicant: BAE SYSTEMS Information and Electronic Systems Integration, Inc
    Inventors: Tushar T. Shah, Keith K. Sturcken, Steven Wright