Patents by Inventor Tuy T. Ton

Tuy T. Ton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microelectronic device having signal distribution functionality on an interfacial layer thereof
    Patent number: 6894399
    Abstract: A microelectronic device includes a microelectronic die having an interfacial metal layer deposited over an active surface thereof to perform a signal distribution function within the device. The microelectronic die is fixed within a package core to form a die/core assembly. One or more metallization layers may then be built up over the die/core assembly as part of a packaging scheme. The interfacial metal layer can be applied either before or after the die is fixed within the package core. In one approach, the interfacial layer is applied during wafer-level processing.
    Type: Grant
    Filed: April 30, 2001
    Date of Patent: May 17, 2005
    Assignee: Intel Corporation
    Inventors: Quat T. Vu, Tuy T. Ton, Steven Towle
  • Microelectronic device having signal distribution functionality on an interfacial layer thereof
    Publication number: 20020158334
    Abstract: A microelectronic device includes a microelectronic die having an interfacial metal layer deposited over an active surface thereof to perform a signal distribution function within the device. The microelectronic die is fixed within a package core to form a die/core assembly. One or more metallization layers may then be built up over the die/core assembly as part of a packaging scheme. The interfacial metal layer can be applied either before or after the die is fixed within the package core. In one approach, the interfacial layer is applied during wafer-level processing.
    Type: Application
    Filed: April 30, 2001
    Publication date: October 31, 2002
    Applicant: Intel Corporation
    Inventors: Quat T. Vu, Tuy T. Ton, Steven Towle