Patents by Inventor Tuyet Le

Tuyet Le has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hot melt adhesive
    Patent number: 7208541
    Abstract: A hot melt adhesive based on ethylene-2-ethylhexyl acrylate copolymer finds use in packaging applications where high heat resistance, as well as good cold tolerance, is required.
    Type: Grant
    Filed: August 22, 2003
    Date of Patent: April 24, 2007
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Lie-zhong Gong, Melissa L. Allen, Justin A. Mehaffy, Darshak R. Desai, Dale L. Haner, Tuyet Le
  • Hot melt adhesive
    Publication number: 20050042469
    Abstract: A hot melt adhesive based on ethylene-2-ethylhexyl acrylate copolymer finds use in packaging applications where high heat resistance, as well as good cold tolerance, is required.
    Type: Application
    Filed: August 22, 2003
    Publication date: February 24, 2005
    Inventors: Lie-zhong Gong, Melissa Allen, Justin Mehaffy, Darshak Desai, Dale Haner, Tuyet Le