Patents by Inventor Tuyet T. Bach

Tuyet T. Bach has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing microscopic canals within a semiconductor
    Patent number: 6387791
    Abstract: A method for manufacturing microscopic canals within a semiconductor is disclosed. A shallow trench is initially formed on a substrate using a patterned photoresist. After the patterned photoresist has been removed from the substrate, a separation layer, such as a Titanium layer, is deposited on the substrate. Subsequently, a cap layer, such as a Titanium nitride layer, is deposited on the separation layer. Both the separation layer and the cap layer are then polished off from the surface of the substrate. Finally, a Tungsten layer is deposited on the substrate and in the trench such that a microcanal will be formed within the trench as a result.
    Type: Grant
    Filed: December 14, 2000
    Date of Patent: May 14, 2002
    Assignee: BAE Systems, Information and Electronic Systems Integration, Inc.
    Inventors: Tom J. McIntyre, Tuyet T. Bach, Andrew TS Pomerene