Patents by Inventor Tuyoshi Hishida

Tuyoshi Hishida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method of manufacturing the same
    Patent number: 5338704
    Abstract: A conductive adhesive such as gold paste is coated and solidified on a lead provided on a frame for manufacture. Wire bonding between a semiconductor chip bonded to the frame and the lead provided thereon is effected between the semiconductor chip and a conductive adhesive layer solidified on the lead. It is thus possible to dispense with a conventional step of plating the frame (with gold) for effecting the wire bonding. In addition, it is possible to obtain reliable wire bonding irrespective of the kind of the base material of the frame or the surface roughness thereof. Further, it is possible to extremely simplify the process on the frame and save gold or like expensive material used as a plating material. Thus, it is possible to extremely reduce the cost of semiconductor device manufacture.
    Type: Grant
    Filed: November 2, 1992
    Date of Patent: August 16, 1994
    Assignee: Rohm Co., Ltd.
    Inventors: Atsushi Imai, Tuyoshi Hishida