Patents by Inventor Twila Jo Eichman

Twila Jo Eichman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate dielectric crack prevention using interleaved metal plane
    Patent number: 10537019
    Abstract: Embodiments of a substrate are provided herein, which include: a first metal plane and a second metal plane in a first metal layer, the first and second metal planes laterally separated by a first gap of dielectric material; and a third metal plane and a fourth metal plane in a second metal layer vertically adjacent to the first metal layer, the third and fourth metal planes laterally separated by a second gap of dielectric material, wherein the second gap comprises a first laterally-shifted gap portion and a second laterally-shifted gap portion, the first laterally-shifted gap portion is laterally offset from a vertical footprint of the first gap in a first lateral direction, and the second laterally-shifted gap portion is laterally offset from the vertical footprint of the first gap in a second lateral direction opposite the first lateral direction.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: January 14, 2020
    Assignee: NXP USA, Inc.
    Inventors: Tingdong Zhou, Twila Jo Eichman, Stanley Andrew Cejka, James S. Golab, Chee Seng Foong