Patents by Inventor Ty L. Baker

Ty L. Baker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9958104
    Abstract: A motor lead extends alongside an electrical pump assembly for supplying electrical power to the motor. The motor lead has electrical power wires positioned side-by-side in a sub assembly. Each of the electrical power wires has an electrical conductor encased in an insulation layer, which in turn is encased in a lead sheath. A metallic band armor wraps around the sub assembly. A thermal barrier layer is located between an inward facing side of the sub assembly and the pump assembly. The thermal barrier layer is formed of thermal insulation material and has a width at least equal to a width of the sub assembly. The motor lead is free of any thermal barrier layers on the outward facing side of the sub assembly to as to allow heat within the sub assembly to dissipate outward.
    Type: Grant
    Filed: December 29, 2014
    Date of Patent: May 1, 2018
    Assignee: Baker Hughes, a GE Company, LLC
    Inventors: Ty L. Baker, Leslie C. Reid
  • Publication number: 20150184790
    Abstract: An electrical submersible pump assembly has a pump, a motor, and a pressure equalizer. A motor lead extends alongside the pump assembly for supplying electrical power to the motor. The motor lead has electrical power wires positioned side-by-side in a sub assembly. Each of the electrical power wires has an electrical conductor encased in an insulation layer, which in turn is encased in a lead sheath. A metallic band armor wraps around the sub assembly. A thermal barrier layer is located between an inward facing side of the sub assembly and the pump assembly. The thermal barrier layer is formed of thermal insulation material and has a width at least equal to a width of the sub assembly. The motor lead is free of any thermal barrier layers on the outward facing side of the sub assembly to as to allow heat within the sub assembly to dissipate outward.
    Type: Application
    Filed: December 29, 2014
    Publication date: July 2, 2015
    Inventors: Ty L. Baker, Leslie C. Reid