Patents by Inventor Tyan M. Niu

Tyan M. Niu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mechanically enhanced, high impact strength triazine resins, and method of preparing same
    Patent number: 5250347
    Abstract: Disclosed are filled poly(triazine) resin dielectrics and microelectronic circuit packages incorporating them. In the filled poly (triazine) dielectric composites, dispersed thermoplastic polymeric fillers are used to reduce the brittleness and increase the ductility of the triazine polymer, while preserving the low dielectric constant of the triazine host matrix-based composite.
    Type: Grant
    Filed: March 10, 1992
    Date of Patent: October 5, 1993
    Assignee: International Business Machines Corporation
    Inventors: Ashit A. Mehta, Tyan M. Niu, Lee P. Springer, William J. Summa, Lee P. Wilding