Patents by Inventor Tygh James Newton

Tygh James Newton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10306775
    Abstract: A method of forming an electrical interconnect includes etching a lattice pattern into a contact pad on a circuit substrate as a first connection point, at least partially filling the lattice pattern with a conductive epoxy, contacting the conductive epoxy with a second connection point, and curing the epoxy.
    Type: Grant
    Filed: January 19, 2017
    Date of Patent: May 28, 2019
    Assignee: XEROX CORPORATION
    Inventors: Chad David Freitag, Tygh James Newton, Chad Johan Slenes
  • Publication number: 20170135228
    Abstract: A method of forming an electrical interconnect includes etching a lattice pattern into a contact pad on a circuit substrate as a first connection point, at least partially filling the lattice pattern with a conductive epoxy, contacting the conductive epoxy with a second connection point, and curing the epoxy.
    Type: Application
    Filed: January 19, 2017
    Publication date: May 11, 2017
    Inventors: Chad David Freitag, Tygh James Newton, Chad Johan Slenes
  • Patent number: 9572254
    Abstract: An electrical interconnect has a circuit substrate and an electrical connection point on the circuit substrate. The electrical connection point includes a lattice of conductive material that is adjacent a gap in the circuit substrate and has anchor points that are attached to the circuit substrate. In some configurations, a conductive epoxy encapsulates at least a portion of the lattice of conductive material and may include a second electrical connection point that is bonded to the other electrical connection point through the conductive epoxy.
    Type: Grant
    Filed: January 17, 2012
    Date of Patent: February 14, 2017
    Assignee: XEROX CORPORATION
    Inventors: Chad David Freitag, Tygh James Newton, Chad Johan Slenes
  • Publication number: 20130180771
    Abstract: An electrical interconnect has a circuit substrate and an electrical connection point on the circuit substrate. The electrical connection point includes a lattice of conductive material that is adjacent a gap in the circuit substrate and has anchor points that are attached to the circuit substrate. In some configurations, a conductive epoxy encapsulates at least a portion of the lattice of conductive material and may include a second electrical connection point that is bonded to the other electrical connection point through the conductive epoxy.
    Type: Application
    Filed: January 17, 2012
    Publication date: July 18, 2013
    Applicant: XEROX CORPORATION
    Inventors: Chad David Freitag, Tygh James Newton, Chad Johan Slenes