Patents by Inventor Tyler Charles Leuten

Tyler Charles Leuten has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrates, assembles, and techniques to enable multi-chip flip chip packages
    Patent number: 10748873
    Abstract: Substrates, assemblies, and techniques for enabling multi-chip flip chip packages are disclosed herein. For example, in some embodiments, a package substrate may include a first side face; a second side face, wherein the second side face is opposite to the first side face along an axis; a portion of insulating material extending from the first side face to the second side face; wherein a cross-section of the portion of insulating material taken perpendicular to the axis has a stairstep profile. Solder pads may be disposed at base and step surfaces of the portion of insulating material. One or more dies may be coupled to the package substrate (e.g., to form a multi-chip flip chip package), and in some embodiments, additional IC packages may be coupled to the package substrate. In some embodiments, the package substrate may be reciprocally symmetric or approximately reciprocally symmetric.
    Type: Grant
    Filed: September 23, 2015
    Date of Patent: August 18, 2020
    Assignee: Intel Corporation
    Inventors: Mao Guo, Min-Tih Lai, Tyler Charles Leuten
  • SUBSTRATES, ASSEMBLES, AND TECHNIQUES TO ENABLE MULTI-CHIP FLIP CHIP PACKAGES
    Publication number: 20180204821
    Abstract: Substrates, assemblies, and techniques for enabling multi-chip flip chip packages are disclosed herein. For example, in some embodiments, a package substrate may include a first side face; a second side face, wherein the second side face is opposite to the first side face along an axis; a portion of insulating material extending from the first side face to the second side face; wherein a cross-section of the portion of insulating material taken perpendicular to the axis has a stairstep profile. Solder pads may be disposed at base and step surfaces of the portion of insulating material. One or more dies may be coupled to the package substrate (e.g., to form a multi-chip flip chip package), and in some embodiments, additional IC packages may be coupled to the package substrate. In some embodiments, the package substrate may be reciprocally symmetric or approximately reciprocally symmetric.
    Type: Application
    Filed: September 23, 2015
    Publication date: July 19, 2018
    Applicant: Intel Corporation
    Inventors: Mao Guo, Min-Tih Lai, Tyler Charles Leuten