Abstract: Systems for organizing substrates in deposition chambers of material deposition apparatuses are disclosed. Such a system may be configured to organize a large number of substrates (e.g., electronic device subassemblies, such as circuit boards with semiconductor devices and other components secured thereto; partially assembled electronic devices; fully assembled electronic devices; etc.) in a manner that will enable concurrent deposition of material onto all of the substrates of the plurality. The system may be configured to optimize an efficiency with which the substrates are packed into the deposition chamber.