Abstract: One aspect of the present disclosure include a method and system for providing an interactive virtual reality simulation for virtual reality training. A headset, controllers, and/or one or more sensors communicate with a processor to display the interactive virtual reality simulation on a user display within the headset. The interactive virtual reality training for use in facilitating virtually reality simulations including a microscope simulation, a bacteria streaking simulation, and/or a visually inspecting containers simulation.

Abstract: A cooling system circulates cooling air through information technology (IT) modules within a large scale information handling system (IHS). An air handling unit (AHU) directs cooling air through an IT module. The AHU is in communication with a controller. The controller is also in communication with an ambient condition interface to determine a level of a contaminant in outside air. The controller further: determines whether the level of the contaminant exceeds a threshold; and in response to determining that the level of the contaminant exceeds the threshold, configures the AHU to perform a mechanical cooling mode that excludes the outside air by recirculating air within an IT module via the AHU. In response to the level of contaminants not exceeding the threshold and other detected ambient conditions are favorable to using outside air to cool the IHS, the controller configures the AHU to use outside air.

Abstract: Systems and methods for controlling temperature in an information handling system is provided. In certain embodiments, a method may include receiving a desired threshold value, determining if a current real-time system value exceeds the desired threshold value, determining if a power shedding mode is enabled, if the power shedding mode is enabled, adjusting power supplied to the information handling system, and if the power shedding mode is not enabled, dynamically adjusting a fan speed of a cooling fan associated with the information handling system.

Abstract: An information handling system (IHS) cooling system includes a multi-IHS chassis having at least one fan system that produces an airflow. An IHS is positioned in the multi-IHS chassis. The IHS includes an IHS chassis that houses a processing system and a memory system. An airflow channel is defined within the IHS chassis and is configured to receive at least a portion of the airflow produced by the at least one fan system. An airflow impedance element is positioned in the airflow channel, and includes a first orientation in which the airflow impedance element extends into the airflow channel to impede airflow through the airflow channel. The airflow impedance element is configured to change shape as a function of temperature into at least one second orientation that reduces the impedance of airflow through the airflow channel. In some embodiments, the airflow impedance element is a bimetallic plate.

Abstract: A cooling system circulates cooling air through information technology (IT) modules within a large scale information handling system (IHS). An air handling unit (AHU) directs cooling air through an IT module. The AHU is in communication with a controller. The controller is also in communication with an ambient condition interface to determine a level of a contaminant in outside air. The controller further: determines whether the level of the contaminant exceeds a threshold; and in response to determining that the level of the contaminant exceeds the threshold, configures the AHU to perform a mechanical cooling mode that excludes the outside air by recirculating air within an IT module via the AHU. In response to the level of contaminants not exceeding the threshold and other detected ambient conditions are favorable to using outside air to cool the IHS, the controller configures the AHU to use outside air.

Abstract: A cooling system that provides cooling air for an operating space of a large scale information handling system (IHS) by using an air handling unit (AHU) configured to direct cooling air through the IHS. A controller is in communication with an ambient condition interface and the AHU to cause the cooling system to (i) detect the outside ambient condition; (ii) determine whether the outside ambient condition has first condition values that support use of normal cooling mode or second condition values that requires/triggers a hybrid cooling mode; and (iii) in response to determining that the outside ambient condition has the second condition values, perform a hybrid mode mixing of the outside air with recirculated air to moderate the outside air to more efficiently cool the IHS. The cooling system is thus responsive to current/detected conditions and provides an operational mode that yields highest cooling efficiency for the existing ambient condition/s.

Abstract: An information handling system (IHS) cooling system includes a multi-IHS chassis having at least one fan system that produces an airflow. An IHS is positioned in the multi-IHS chassis. The IHS includes an IHS chassis that houses a processing system and a memory system. An airflow channel is defined within the IHS chassis and is configured to receive at least a portion of the airflow produced by the at least one fan system. An airflow impedance element is positioned in the airflow channel, and includes a first orientation in which the airflow impedance element extends into the airflow channel to impede airflow through the airflow channel. The airflow impedance element is configured to change shape as a function of temperature into at least one second orientation that reduces the impedance of airflow through the airflow channel. In some embodiments, the airflow impedance element is a bimetallic plate.

Abstract: A thermal state within an information handling system enclosure is managed within predetermined constraints by estimating thermal energy introduced to the enclosure by power dissipation to electronic components and thermal energy removed from the enclosure by a cooling airflow generated by a fan. A desired bulk temperature of a cooling airflow is attained at a predetermined position in an enclosure by selecting a fan speed and power allocation to the components that conserves energy within the enclosure at a predetermined thermal state.

Abstract: In accordance with the present disclosure, a system and method for an optimizable rack solution is presented. The system and method is directed to an optimizable rack that includes a frame. The frame has both a primary portion and a detachable portion. The primary portion may contain a primary enclosure and the detachable portion may container a secondary enclosure. Each of the primary enclosure and secondary enclosure are sized to hold a plurality of computing systems. Detaching the detachable portion of the frame both reduces the size and computing systems capacity of the frame.

Abstract: Systems and methods for controlling temperature in an information handling system is provided. In certain embodiments, a method may include receiving a desired threshold value, determining if a current real-time system value exceeds the desired threshold value, determining if a power shedding mode is enabled, if the power shedding mode is enabled, adjusting power supplied to the information handling system, and if the power shedding mode is not enabled, dynamically adjusting a fan speed of a cooling fan associated with the information handling system.

Abstract: In accordance with the present disclosure, a system and method for an optimizable rack solution is presented. The system and method is directed to an optimizable rack that includes a frame. The frame has both a primary portion and a detachable portion. The primary portion may contain a primary enclosure and the detachable portion may container a secondary enclosure. Each of the primary enclosure and secondary enclosure are sized to hold a plurality of computing systems. Detaching the detachable portion of the frame both reduces the size and computing systems capacity of the frame.

Abstract: A thermal state within an information handling system enclosure is managed within predetermined constraints by estimating thermal energy introduced to the enclosure by power dissipation to electronic components and thermal energy removed from the enclosure by a cooling airflow generated by a fan. A desired bulk temperature of a cooling airflow is attained at a predetermined position in an enclosure by selecting a fan speed and power allocation to the components that conserves energy within the enclosure at a predetermined thermal state.

Abstract: Systems and methods for controlling temperature in an information handling system is provided. In certain embodiments, a method may include receiving a desired threshold value, determining if a current real-time system value exceeds the desired threshold value, determining if a power shedding mode is enabled, if the power shedding mode is enabled, adjusting power supplied to the information handling system, and if the power shedding mode is not enabled, dynamically adjusting a fan speed of a cooling fan associated with the information handling system.

Abstract: In accordance with the present disclosure, a system and method for an optimizable rack solution is presented. The system and method is directed to an optimizable rack that includes a frame. The frame has both a primary portion and a detachable portion. The primary portion may contain a primary enclosure and the detachable portion may container a secondary enclosure. Each of the primary enclosure and secondary enclosure are sized to hold a plurality of computing systems. Detaching the detachable portion of the frame both reduces the size and computing systems capacity of the frame.

Abstract: In accordance with the present disclosure, a system and method for a modular fluid handling system with modes in a modular data center is presented. According to the present application, a modular data center may include a modular primary structure. The modular primary structure may include a plurality of information handling systems arranged in racks within it. The modular data center may also include a modular fluid handling system that circulates fluid through the modular primary structure according, at least in part, to a plurality of modes. The modular fluid handling system may be designed to accommodate environmental conditions in which the modular data center will operate as well as the usage requirements of the modular primary structure.

Abstract: In accordance with the present disclosure, a system and method for structural power distribution in a modular data center. In particular, the present application describes a modular data center with a modular structural frame. The modular structural frame defines an enclosure, and a plurality of information handling systems may be located in the enclosure. The modular data center may also include a power distribution pathway that is at least partially disposed within the modular structural frame of the modular data center. The modular data center may also include a plurality of power distribution elements disposed within the power distribution pathway, which power the information handling systems located in the enclosure.

Abstract: In accordance with the present disclosure, a system and method for a modular fluid handling system with modes in a modular data center is presented. According to the present application, a modular data center may include a modular primary structure. The modular primary structure may include a plurality of information handling systems arranged in racks within it. The modular data center may also include a modular fluid handling system that circulates fluid through the modular primary structure according, at least in part, to a plurality of modes. The modular fluid handling system may be designed to accommodate environmental conditions in which the modular data center will operate as well as the usage requirements of the modular primary structure.

Abstract: In accordance with the present disclosure, a system and method for an optimizable rack solution is presented. The system and method is directed to an optimizable rack that includes a frame. The frame has both a primary portion and a detachable portion. The primary portion may contain a primary enclosure and the detachable portion may container a secondary enclosure. Each of the primary enclosure and secondary enclosure are sized to hold a plurality of computing systems. Detaching the detachable portion of the frame both reduces the size and computing systems capacity of the frame.

Abstract: In accordance with the present disclosure, a system and method for structural power distribution in a modular data center. In particular, the present application describes a modular data center with a modular structural frame. The modular structural frame defines an enclosure, and a plurality of information handling systems may be located in the enclosure. The modular data center may also include a power distribution pathway that is at least partially disposed within the modular structural frame of the modular data center. The modular data center may also include a plurality of power distribution elements disposed within the power distribution pathway, which power the information handling systems located in the enclosure.

Abstract: In accordance with the present disclosure, a system and method for concurrent manufacturing, testing, and integration of a modular data center is presented. According to the disclosure, a first component of a modular data center and a second component of a modular data center may be separately and concurrently manufactured. The first component may include a first pre-designed integration element, and the second component may include a second pre-designed integration element. The manufactured first component and the manufactured second component are then integrated, using an integration process which utilizes the first pre-designed integration element and the second pre-designed integration element.