Patents by Inventor Tyler Gloski

Tyler Gloski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrostatic chuck including declamping electrode and method of declamping
    Patent number: 9101038
    Abstract: A semiconductor wafer processing apparatus for processing semiconductor wafers comprises a semiconductor wafer processing chamber in which a semiconductor wafer is processed, a process gas source in fluid communication with the processing chamber adapted to supply process gas into the processing chamber, a vacuum source adapted to exhaust process gas and byproducts of the processing from the processing chamber, and an electrostatic chuck assembly.
    Type: Grant
    Filed: December 20, 2013
    Date of Patent: August 4, 2015
    Assignee: LAM RESEARCH CORPORATION
    Inventors: Harmeet Singh, Christopher Kimball, Keith Gaff, Tyler Gloski
  • ELECTROSTATIC CHUCK INCLUDING DECLAMPING ELECTRODE AND METHOD OF DECLAMPING
    Publication number: 20150181683
    Abstract: A semiconductor wafer processing apparatus for processing semiconductor wafers comprises a semiconductor wafer processing chamber in which a semiconductor wafer is processed, a process gas source in fluid communication with the processing chamber adapted to supply process gas into the processing chamber, a vacuum source adapted to exhaust process gas and byproducts of the processing from the processing chamber, and an electrostatic chuck assembly.
    Type: Application
    Filed: December 20, 2013
    Publication date: June 25, 2015
    Applicant: Lam Research Corporation
    Inventors: Harmeet Singh, Christopher Kimball, Keith Gaff, Tyler Gloski