Patents by Inventor Tyler J. Smith

Tyler J. Smith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240108124
    Abstract: One or more devices are provided that are configured to detachably engage within a modular system. The one or more devices are expandable to provide a surface to perform work.
    Type: Application
    Filed: December 12, 2023
    Publication date: April 4, 2024
    Inventors: Aaron S. Blumenthal, Aaron M. Williams, Ryan C. Dick, Tyler J. Smith, Benjamin T. Jones, George Barton, Matthew A. Lownik
  • Patent number: 11882929
    Abstract: One or more devices are provided that are configured to detachably engage within a modular system. The one or more devices are expandable to provide a surface to perform work.
    Type: Grant
    Filed: February 10, 2022
    Date of Patent: January 30, 2024
    Assignee: Milwaukee Electric Tool Corporation
    Inventors: Aaron S. Blumenthal, Aaron M. Williams, Ryan C. Dick, Tyler J. Smith, Benjamin T. Jones, George Barton, Matthew A. Lownik
  • Publication number: 20220240671
    Abstract: One or more devices are provided that are configured to detachably engage within a modular system. The one or more devices are expandable to provide a surface to perform work.
    Type: Application
    Filed: February 10, 2022
    Publication date: August 4, 2022
    Inventors: Aaron S. Blumenthal, Aaron M. Williams, Ryan C. Dick, Tyler J. Smith, Benjamin T. Jones, George Barton, Matthew A. Lownik
  • Patent number: D1056660
    Type: Grant
    Filed: January 13, 2023
    Date of Patent: January 7, 2025
    Assignee: Milwaukee Electric Tool Corporation
    Inventor: Tyler J. Smith