Abstract: An approach is disclosed herein for balancing layer densities in using an automated process. The approach disclosed herein operates on a region-by-region and layer-by-layer basis to perform parameterized layer balancing. In some embodiments, the process comprises determining densities of respective layers in respective regions, evaluating each layer and region to determine whether operations need to be taken to balance those layers in the corresponding regions, determining what those actions should be, and then implementing those actions. Additionally, in some embodiments, the process may operate in different orders and may be associated with a looping flow until a layout being processed has been balanced.

Abstract: Various embodiments of the present invention relate to a method, system, and computer program product for dynamic placement of various bond fingers on an integrated circuit (IC) package. This is achieved by determining the placement of selected bond fingers. Subsequently, bond fingers and bond wires are identified, which have been affected due to the placement of the selected bond fingers. Further, the placement of the selected and the affected bond fingers is determined based on clearance rules and the affected bond fingers and bond wires. This facilitates the dynamic placement of the various bond fingers in interaction with the user. Further, the user is provided with full interactive access and control over the method and system.