Patents by Inventor Tyler Jamison Dill

Tyler Jamison Dill has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11846580
    Abstract: A flow cell package includes first and second surface-modified patterned wafers and a spacer layer. The first surface-modified patterned wafer includes first depressions separated by first interstitial regions, a first functionalized molecule bound to a first silane or silane derivative in at least some of the first depressions, and a first primer grafted to the first functionalized molecule in the at least some of the first depressions. The second surface-modified patterned wafer includes second depressions separated by second interstitial regions, a second functionalized molecule bound to a second silane or silane derivative in at least some of the second depressions, and a second primer grafted to the second functionalized molecule in the at least some of the second depressions. The spacer layer bonds at least some first interstitial regions to at least some second interstitial regions, and at least partially defines respective fluidic chambers of the flow cell package.
    Type: Grant
    Filed: March 3, 2021
    Date of Patent: December 19, 2023
    Assignees: Illumina, Inc., Illumina Cambridge Limited
    Inventors: James Tsay, Anmiv Prabhu, David Heiner, Edwin Li, Alexandre Richez, John M. Beierle, Kevan Samiee, Kristina Munoz, Leonid Malevanchik, Ludovic Vincent, Naiqian Zhan, Peyton Shieh, Robert Yang, Samantha Schmitt, Sang Park, Scott Bailey, Sean M. Ramirez, Sunmin Ahn, Valerie Uzzell, Wei Wei, Yuxiang Huang, Tyler Jamison Dill
  • Publication number: 20210208055
    Abstract: A flow cell package includes first and second surface-modified patterned wafers and a spacer layer. The first surface-modified patterned wafer includes first depressions separated by first interstitial regions, a first functionalized molecule bound to a first silane or silane derivative in at least some of the first depressions, and a first primer grafted to the first functionalized molecule in the at least some of the first depressions. The second surface-modified patterned wafer includes second depressions separated by second interstitial regions, a second functionalized molecule bound to a second silane or silane derivative in at least some of the second depressions, and a second primer grafted to the second functionalized molecule in the at least some of the second depressions. The spacer layer bonds at least some first interstitial regions to at least some second interstitial regions, and at least partially defines respective fluidic chambers of the flow cell package.
    Type: Application
    Filed: March 3, 2021
    Publication date: July 8, 2021
    Inventors: James Tsay, Anmiv Prabhu, David Heiner, Edwin Li, Alexandre Richez, John M. Beierle, Kevan Samiee, Kristina Munoz, Leonid Malevanchik, Ludovic Vincent, Naiqian Zhan, Peyton Shieh, Robert Yang, Samantha Schmitt, Sang Park, Scott Bailey, Sean M. Ramirez, Sunmin Ahn, Valerie Uzzell, Wei Wei, Yuxiang Huang, Tyler Jamison Dill
  • Patent number: 10955332
    Abstract: A flow cell package includes first and second surface-modified patterned wafers and a spacer layer. The first surface-modified patterned wafer includes first depressions separated by first interstitial regions, a first functionalized molecule bound to a first silane or silane derivative in at least some of the first depressions, and a first primer grafted to the first functionalized molecule in the at least some of the first depressions. The second surface-modified patterned wafer includes second depressions separated by second interstitial regions, a second functionalized molecule bound to a second silane or silane derivative in at least some of the second depressions, and a second primer grafted to the second functionalized molecule in the at least some of the second depressions. The spacer layer bonds at least some first interstitial regions to at least some second interstitial regions, and at least partially defines respective fluidic chambers of the flow cell package.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: March 23, 2021
    Assignees: Illumina, Inc., Illumina Cambridge Limited
    Inventors: James Tsay, Anmiv Prabhu, David Heiner, Edwin Li, Alexandre Richez, John M. Beierle, Kevan Samiee, Kristina Munoz, Leonid Malevanchik, Ludovic Vincent, Naiqian Zhan, Peyton Shieh, Robert Yang, Samantha Schmitt, Sang Park, Scott Bailey, Sean M. Ramirez, Sunmin Ahn, Valerie Uzzell, Wei Wei, Yuxiang Huang, Tyler Jamison Dill
  • Publication number: 20180195950
    Abstract: A flow cell package includes first and second surface-modified patterned wafers and a spacer layer. The first surface-modified patterned wafer includes first depressions separated by first interstitial regions, a first functionalized molecule bound to a first silane or silane derivative in at least some of the first depressions, and a first primer grafted to the first functionalized molecule in the at least some of the first depressions. The second surface-modified patterned wafer includes second depressions separated by second interstitial regions, a second functionalized molecule bound to a second silane or silane derivative in at least some of the second depressions, and a second primer grafted to the second functionalized molecule in the at least some of the second depressions. The spacer layer bonds at least some first interstitial regions to at least some second interstitial regions, and at least partially defines respective fluidic chambers of the flow cell package.
    Type: Application
    Filed: December 20, 2017
    Publication date: July 12, 2018
    Inventors: James Tsay, Anmiv Prabhu, David Heiner, Edwin Li, Alexandre Richez, John M. Beierle, Kevan Samiee, Kristina Munoz, Leonid Malevanchik, Ludovic Vincent, Naiqian Zhan, Peyton Shieh, Robert Yang, Samantha Schmitt, Sang Park, Scott Bailey, Sean M. Ramirez, Sunmin Ahn, Valerie Uzzell, Wei Wei, Yuxiang Huang, Tyler Jamison Dill
  • Patent number: 10012674
    Abstract: The invention provides a nanoantenna scanning probe tip for microscropy or spectroscopy. The nanoantenna scanning probe tip includes a sharp probe tip covered with a contiguous film of predetermined sized and shaped plasmonic nanoparticles. A method for forming the nanoantenna scanning probe tip by trapping nanoparticles having a predetermined size and shape at a liquid surface using surface tension, forming a uniform and organized monolayer film on the liquid surface, and then transferring portions of the film to a sharp probe tip. In preferred embodiments, the sharp probe tip is one of a conductive STM (scanning tunneling microscopy) tip, a tuning fork tip or an AFM (atomic force microscopy) tip. The sharp tip can be blunted with an oxide layer.
    Type: Grant
    Filed: September 6, 2016
    Date of Patent: July 3, 2018
    Assignee: The Regents of the University of California
    Inventors: Tyler Jamison Dill, Andrea Rae Tao
  • Publication number: 20170115323
    Abstract: The invention provides a nanoantenna scanning probe tip for microscropy or spectroscopy. The nanoantenna scanning probe tip includes a sharp probe tip covered with a contiguous film of predetermined sized and shaped plasmonic nanoparticles. A method for forming the nanoantenna scanning probe tip by trapping nanoparticles having a predetermined size and shape at a liquid surface using surface tension, forming a uniform and organized monolayer film on the liquid surface, and then transferring portions of the film to a sharp probe tip. In preferred embodiments, the sharp probe tip is one of a conductive STM (scanning tunneling microscopy) tip, a tuning fork tip or an AFM (atomic force microscopy) tip. The sharp tip can be blunted with an oxide layer.
    Type: Application
    Filed: September 6, 2016
    Publication date: April 27, 2017
    Inventors: Tyler Jamison Dill, Andrea Rae Tao