Abstract: An air moving device (AMD) includes a housing that dampens noise and routes airflow. The AMD housing includes a focal-bearing surface that has an associated focal point. The focal-bearing surface routes airflow through the AMD housing and reflects and concentrates noise to the focal point. The AMD housing further includes a noise dampening structure at the focal point to reduce, absorb, and/or dampen the concentrated noise. Because the noise is concentrated, a relatively smaller size noise dampening structure may effectively or adequately reduce or dampen AMD noise. The smaller size noise dampening structure relatively reduces airflow impedance. As such, AMD housing may provide for both reduced AMD noise and relatively reduced airflow impedance therein and/or therefrom.

Abstract: An electronic board assembly comprises a board comprising an electronic component and a connector mounted to the board and electrically connected to the electronic component. The connector is configured to receive an electronic card assembly, and the connector comprises an electrical contact and a friction contact. The electrical contact is configured to exert a first amount of force on the electronic card assembly when the electronic card assembly is being seated in the connector. The friction contact is configured to exert a second amount of force on the electronic card assembly when the electronic card assembly is being seated in the connector. The second amount of force is greater than the first amount of force.

Abstract: To provide for high-performance communicational throughput between electronic systems, a high-performance connector pair is disclosed. The connector pair includes a pin receptacle and card edge (PRCE) connector that may be seated or connected to a pin and card edge receptacle (PCER) connector. The PRCE connector includes an edge connector, with a plurality of edge connector pads and a pin receptacle connector with a mount region connected to the printed circuit board and a receptacle portion with a plurality of conductive pin receptacles. The PRCE connector further includes a clearance between the edge connector and the receptacle portion. The PCER connector includes a pin and card edge receptacle connector with an edge socket that receives the edge connector and includes a plurality of socket pads. The PCER connector includes further includes a pin socket that receives the receptacle portion with a plurality of pins.

Abstract: Disclosed aspects relate to a structure which includes shape memory materials having transition triggers to transition the shape memory materials between initial states and transitioned states. A first physical shape of the structure exists when the first shape memory material has the first initial state and the second shape memory material has the second initial state. A second physical shape of the structure exists when the first shape memory material has the first transitioned state and the second shape memory material has the second initial state. A third physical shape of the structure exists when the first shape memory material has the first transitioned state and the second shape memory material has the second transitioned state. The physical shapes of the structure are reversible in nature. In embodiments, the shape memory materials are bonded to a flexible substrate or are clad together.

Abstract: An electronic board assembly comprises a board comprising an electronic component and a connector mounted to the board and electrically connected to the electronic component. The connector is configured to receive an electronic card assembly, and the connector comprises an electrical contact and a friction contact. The electrical contact is configured to exert a first amount of force on the electronic card assembly when the electronic card assembly is being seated in the connector. The friction contact is configured to exert a second amount of force on the electronic card assembly when the electronic card assembly is being seated in the connector. The second amount of force is greater than the first amount of force.

Abstract: An electronic component assembly includes a board having an electronic component, a connector mounted to the board and electrically connected to the electronic component and having an anchoring feature positioned on an exterior of the connector, and a card having another electronic component and a securing feature. The electronic component assembly also includes a movable member positioned on one of the connector or the card. The movable member is positioned in the securing feature and contacts the anchoring feature to secure the card in a seated position in the connector, or the anchoring feature includes the movable member and contacts the securing feature to secure the card in the seated position in the connector.

Abstract: An inside surface of a hose for use with liquid-cooled cooling plate assemblies and other applications that contain copper (Cu) components is pre-treated with a hydrophobic coating to reduce depletion of a copper corrosion inhibitor (e.g., benzotriazole (BTA)) dissolved in a liquid coolant (e.g., deionized water) that flows through the hose. Exemplary hydrophobic coatings include, but are not limited to, polydialkylsiloxanes such as polydimethylsiloxanes. In one embodiment, a multilayer hose is immersed in a solution containing hydrophobizing siloxane monomers dissolved in a solvent. The coated multilayer hose is then dried to evaporate the solvent. As the solvent evaporates, the siloxane monomers bind together to form the hydrophobic coating. In some embodiments, one or more hoses each provided with a hydrophobic coating interconnect liquid-coolant cooling system components (e.g.

Abstract: A method, system and computer program product for implementing enhanced component reliability for leading edge components in a server computer system based upon system humidity conditions. A humidity value is identified and compared with a threshold value at an air flow input in contact with the leading edge components. One or more air flow control elements are used to direct air flow based upon the compared humidity values of the server system.

Abstract: Method and apparatus includes a chassis to house circuitry, the chassis having first and second surfaces and an air inlet. An airflow moving device may create an airflow in a first direction that is communicated to the chassis via the air inlet. A wall structure may have a height that extends up from a base of the wall structure in a second direction that is substantially perpendicular to the first direction of the airflow, where the base of the wall structure directly contacts the first surface and forms an elongated opening along a top surface of the wall structure and in between the second surface of the chassis. The airflow may flow over the top surface of the wall structure.

Abstract: An electric packaging including a board and a mechanical component attached to the board. The mechanical component includes a first end attached to the board, a second end opposite the first end, and a seat interposed between the first end and the second end. The mechanical component also includes an upper portion extending from the second end to the seat, the upper portion having a first width and a lower portion extending from the seat to the first end. The lower portion having a second width that is less than the first width. The electric packaging also includes a connector attached to the board. The connector includes a first surface attached to the board and a second surface located opposite the first surface. The second surface includes a plug connection area sized to receive a plug and located completely radially outside of the first width.

Abstract: An electric packaging including a board and a mechanical component attached to the board. The mechanical component includes a first end attached to the board, a second end opposite the first end, and a seat interposed between the first end and the second end. The mechanical component also includes an upper portion extending from the second end to the seat, the upper portion having a first width and a lower portion extending from the seat to the first end. The lower portion having a second width that is less than the first width. The electric packaging also includes a connector attached to the board. The connector includes a first surface attached to the board and a second surface located opposite the first surface. The second surface includes a plug connection area sized to receive a plug and located completely radially outside of the first width.

Abstract: An inside surface of a hose for use with liquid-cooled cooling plate assemblies and other applications that contain copper (Cu) components is pre-treated with a hydrophobic coating to reduce depletion of a copper corrosion inhibitor (e.g., benzotriazole (BTA)) dissolved in a liquid coolant (e.g., deionized water) that flows through the hose. Exemplary hydrophobic coatings include, but are not limited to, polydialkylsiloxanes such as polydimethylsiloxanes. In one embodiment, a multilayer hose is immersed in a solution containing hydrophobizing siloxane monomers dissolved in a solvent. The coated multilayer hose is then dried to evaporate the solvent. As the solvent evaporates, the siloxane monomers bind together to form the hydrophobic coating. In some embodiments, one or more hoses each provided with a hydrophobic coating interconnect liquid-coolant cooling system components (e.g.

Abstract: An apparatus includes a printed circuit board (PCB) having a top surface, where the top surface includes a mounting aperture, a chassis, and a fastener having a width and length extending at least from the top surface of the PCB to the chassis through the mounting aperture. The apparatus also may include a logic ring that includes a via to a logic circuit of the PCB and a washer including a substantially flat surface including a high yield strength material. The washer may include a through-hole to accommodate the width of the fastener. The washer may additionally include a plurality of contact fingers extending out from the through-hole. The plurality of contact fingers is configured to contact the logic ring. The washer may be made to be in electrical communication with the chassis when compressed in response to a downward force from the fastener.

Abstract: Method and apparatus includes a chassis to house circuitry, the chassis having first and second surfaces and an air inlet. An airflow moving device may create an airflow in a first direction that is communicated to the chassis via the air inlet. A wall structure may have a height that extends up from a base of the wall structure in a second direction that is substantially perpendicular to the first direction of the airflow, where the base of the wall structure directly contacts the first surface and forms an elongated opening along a top surface of the wall structure and in between the second surface of the chassis. The airflow may flow over the top surface of the wall structure.

Abstract: An apparatus includes a printed circuit board (PCB) having a top surface, where the top surface includes a mounting aperture, a chassis, and a fastener having a width and length extending at least from the top surface of the PCB to the chassis through the mounting aperture. The apparatus also may include a logic ring that includes a via to a logic circuit of the PCB and a washer including a substantially flat surface including a high yield strength material. The washer may include a through-hole to accommodate the width of the fastener. The washer may additionally include a plurality of contact fingers extending out from the through-hole. The plurality of contact fingers is configured to contact the logic ring. The washer may be made to be in electrical communication with the chassis when compressed in response to a downward force from the fastener.

Abstract: A method, system and computer program product for implementing enhanced component reliability for leading edge components in a server computer system based upon system humidity conditions. A humidity value is identified and compared with a threshold value at an air flow input in contact with the leading edge components. One or more air flow control elements are used to direct air flow based upon the compared humidity values of the server system.

Abstract: An inside surface of a hose for use with liquid-cooled cooling plate assemblies and other applications that contain copper (Cu) components is pre-treated with a hydrophobic coating to reduce depletion of a copper corrosion inhibitor (e.g., benzotriazole (BTA)) dissolved in a liquid coolant (e.g., deionized water) that flows through the hose. Exemplary hydrophobic coatings include, but are not limited to, polydialkylsiloxanes such as polydimethylsiloxanes. In one embodiment, a multilayer hose is immersed in a solution containing hydrophobizing siloxane monomers dissolved in a solvent. The coated multilayer hose is then dried to evaporate the solvent. As the solvent evaporates, the siloxane monomers bind together to form the hydrophobic coating. In some embodiments, one or more hoses each provided with a hydrophobic coating interconnect liquid-coolant cooling system components (e.g.

Abstract: An inside surface of a hose for use with liquid-cooled cooling plate assemblies and other applications that contain copper (Cu) components is pre-treated with a hydrophobic coating to reduce depletion of a copper corrosion inhibitor (e.g., benzotriazole (BTA)) dissolved in a liquid coolant (e.g., deionized water) that flows through the hose. Exemplary hydrophobic coatings include, but are not limited to, polydialkylsiloxanes such as polydimethylsiloxanes. In one embodiment, a multilayer hose is immersed in a solution containing hydrophobizing siloxane monomers dissolved in a solvent. The coated multilayer hose is then dried to evaporate the solvent. As the solvent evaporates, the siloxane monomers bind together to form the hydrophobic coating. In some embodiments, one or more hoses each provided with a hydrophobic coating interconnect liquid-coolant cooling system components (e.g.

Abstract: A computer system may determine a target position of the electronic component. The computer system may also determine a current position of the electronic component. The computer system may compare the current position to the target to position to determine whether the electronic component is in the target position. If the electronic component is not in the target position, the computer system may use an electroactive polymer to adjust the position of the electronic component to move the electronic component into the target position.

Abstract: An inside surface of a hose for use with liquid-cooled cooling plate assemblies and other applications that contain copper (Cu) components is pre-treated with a hydrophobic coating to reduce depletion of a copper corrosion inhibitor (e.g., benzotriazole (BTA)) dissolved in a liquid coolant (e.g., deionized water) that flows through the hose. Exemplary hydrophobic coatings include, but are not limited to, polydialkylsiloxanes such as polydimethylsiloxanes. In one embodiment, a multilayer hose is immersed in a solution containing hydrophobizing siloxane monomers dissolved in a solvent. The coated multilayer hose is then dried to evaporate the solvent. As the solvent evaporates, the siloxane monomers bind together to form the hydrophobic coating. In some embodiments, one or more hoses each provided with a hydrophobic coating interconnect liquid-coolant cooling system components (e.g.