Abstract: Disclosed is a contactless card, and a system in which the contactless card may be used. The contactless card may include a chip component, a communication interface, processing circuitry, and electromagnetic field sensing circuitry. The electromagnetic field sensing circuitry of the contactless card may be operable to provide orientation signals to the processing circuitry when the contactless card is in proximity to an oscillating electromagnetic field output by a card reader device. The processing circuitry of the contactless card may be operable to receive the orientation signals. An orientation of the contactless card with respect to the mobile device may be determined. An orientation indication signal may be generated based on the determined orientation, and a haptic indication, an audio indication, a visual indication or a combination directing movement of the contactless card in a particular direction may be output.

Abstract: Embodiments are directed to methods and techniques for providing power via piezoelectric components on contactless cards.

Abstract: Provided are approaches for customizing transaction cards using a pressure sensitive modification area. In some approaches, a transaction card may include a body having a first main side opposite a second main side, wherein a chip is coupled to the first main side of the body, wherein a first outer layer extends along the first main side, and wherein a second outer layer extends along the second main side. The transaction card may further include an internal layer between the first and second outer layers, and a plurality of microspheres and a pigmented substance positioned between the internal layer and the first outer layer.

Abstract: A payment instrument comprising a bottom layer; one or more intermediate layers, wherein at least one of the one or more intermediate layers comprises: a chip comprising a processor and memory; an antenna coupled with the chip; an absorbent medium; and one or more reservoirs comprising beads, each of the beads comprising dyes of one or more colors, the beads configured to release the dyes onto the absorption medium. The dyes cure on the absorption medium at a rate based on a curing agent applied to the absorbent medium or included in beads of the reservoirs. The payment instrument may also comprise a top layer having at least a partially translucent portion above the absorption medium, wherein the absorption medium is at least partially visible through the at least one partially translucent portion.

Abstract: Cards having a hybrid construction including a biodegradable portion and related methods are disclosed. A card can include a card body having a top surface and a bottom surface opposite the top surface, the top and bottom surfaces meeting at a peripheral edge of the card body; and a first portion secured to a second portion such that the top surface of the card body spans both the first and second portions and the bottom surface is formed entirely of the second portion. The card can further include a chip secured to the first portion of the card body; wherein the peripheral edge includes at least an insertion edge of the first portion; wherein the second portion of the card body comprises a biodegradable material; and wherein the first portion and a recyclable portion meet at a frangible junction on the top surface of the card body.

Abstract: In a general aspect, a quantum computing method is described. In some aspects, a control system in a quantum computing system assigns subsets of qubit devices in a quantum processor to respective cores. The control system identifies boundary qubit devices residing between the cores in the quantum processor and generates control sequences for each respective core. A signal delivery system in communication with the control system and the quantum processor receives control signals to execute the control sequences, and the control signals are applied to the respective cores in the quantum processor.

Abstract: A transaction card is provided. The transaction card can include a luminous layer having a sensitive information component. The sensitive information component includes personal account data and can be selectively illuminated by a light source by refracting light emitted by the light source. A switch and power source are provided to selectively energize the light source.

Abstract: A die assembly formed on a thin dielectric sheet is described. In one example, a first and a second die have interconnect areas. A dielectric sheet is over the interconnect areas of the first and the second die. Conductive vias in the dielectric sheet connect with pads of the interconnect areas. A build-up layer over the dielectric sheet includes routing to connect pads of the first die interconnect area to pads of the second die interconnect area through the conductive vias. The dies are mounted to a package substrate through the build-up layers, and a package cover is over the dies, the dielectric sheet, and the build-up layer.

Abstract: A die assembly formed on a thin dielectric sheet is described. In one example, a first and a second die have interconnect areas. A dielectric sheet, such as glass, silicon, or oxidized metal is applied over the interconnect areas of dies. Conductive vias are formed in the dielectric sheet to connect with pads of the interconnect areas. A build-up layer includes routing to connect pads of the first die interconnect area to pads of the second die interconnect area through the conductive vias and a cover is applied over the dies, the dielectric sheet, and the build-up layer.

Abstract: A die assembly formed on a thin dielectric sheet is described. In one example, a first and a second die have interconnect areas. A dielectric sheet, such as glass, silicon, or oxidized metal is applied over the interconnect areas of dies. Conductive vias are formed in the dielectric sheet to connect with pads of the interconnect areas. A build-up layer includes routing to connect pads of the first die interconnect area to pads of the second die interconnect area through the conductive vias and a cover is applied over the dies, the dielectric sheet, and the build-up layer.

Abstract: Integrated circuit interconnection devices and methods are provided. An interconnection to connect components can comprise a first portion, a second portion, and a joining portion. The first portion can extend from a first component, and the first portion can be made with a single conductor. The second portion can extend from a second component, and the second portion can be made with the single conductor. The joining section can be disposed between the first portion and the second portion so that the first component and second component are interconnected to each other to form an interconnect. The joining section can be made of the single conductor so that the interconnect structure consists only of the single conductor. An interconnect can also be formed with two portions, and be formed to have a high-aspect ratio. Other embodiments are also claimed and described.