Abstract: A product processing and packing system including a product classifier to determine a product classification of a product as a function of sensor data. The system also has a sorting conveyor to guide the product to a loading station or other product receiving area. The system also has at least one processor to control the sorting of the product into the desired loading station or product receiving area as a function of the product classification. The system may also have a packed box merge and take away system.

Abstract: A product processing and packing system including a product classifier to determine a product classification of a product as a function of sensor data. The system also has a sorting conveyor to guide the product to a loading station or other product receiving area. The system also has at least one processor to control the sorting of the product into the desired loading station or product receiving area as a function of the product classification. The system may also have a packed box merge and take away system.

Abstract: Various gapping conveyors and classification conveyors, including combination gapping and classification conveyors along with separate gapping conveyors and classification devices. In some embodiments, the gapping scale conveyor system includes both a gapping conveyor and a multi-zone scale conveyor in the same device and further includes a computing device for controlling the two conveyors. In other embodiments, a gapping conveyor having three conveyor belts is provided, and separately a classification device is provided having a conveyor with a scale and a hood with various sensors therein, including an imaging device.

Abstract: A product processing and packing system including a product classifier to determine a product classification of a product as a function of sensor data. The system also has a sorting conveyor to guide the product to a loading station or other product receiving area. The system also has at least one processor to control the sorting of the product into the desired loading station or product receiving area as a function of the product classification. The system may also have a packed box merge and take away system.

Abstract: A product distribution system including a chute and a controller. The chute includes a variable friction angled surface configured to receive a product and/or slidably transport the product along the angled surface. The controller is operatively coupled with the chute. The controller is configured to vary an amount of friction at the angled surface based on information about the product.

Abstract: Embodiments included herein may be configured for controlling jerk on one or more robotic joints of a robot. Embodiments may include calculating a first path to be traveled by a robot without applying one or more jerk restrictions. One or more jerk restrictions may be applied to the first path after the first path has been calculated to generate a second path.

Abstract: High speed autofocus interferometric inspection systems and methods are discussed in this Application. In accordance with some embodiments, an inspection system can generally include a laser module, an interferometer module, and a system controller. The laser can produce laser pulses to excite a device such as a silicon wafer, chip capacitor or chip packaged/silicon die containing a plurality of solder bumps into vibration. The interferometer module can be disposed to receive reflected laser energy from the device to sense vibration displacements created in the device with the laser pulses. The system controller to receive vibration data from the interferometer, the system controller configured to output a control signal for adjusting a relative distance and position between the laser module and the device. Other aspects, features, and embodiments are also claimed and discussed.

Abstract: High speed autofocus interferometric inspection systems and methods are discussed in this application. In accordance with some embodiments, an inspection system can generally include a laser module, an interferometer module, and a system controller. The laser can produce laser pulses to excite a device such as a silicon wafer, chip capacitor or chip packaged/silicon die containing a plurality of solder bumps into vibration. The interferometer module can be disposed to receive reflected laser energy from the device to sense vibration displacements created in the device with the laser pulses. The system controller to receive vibration data from the interferometer, the system controller configured to output a control signal for adjusting a relative distance and position between the laser module and the device. Other aspects, features, and embodiments are also claimed and discussed.