Abstract: Fluid within a reflection optical switch system is purified. Gettering structures are placed within a chamber within the reflection optical switch system. The gettering structures includes heating components which when actuated attract impurities. The heating components within the gettering structures are turned on to getter out impurities from fluid within the chamber.

Abstract: A silicon chip is attached to a planar light circuit. A recessed moat is formed around an output perimeter of a surface of the silicon chip. When soldering the silicon chip to the planar light circuit, the recessed moat is filled with solder.

Abstract: A heating device within an integrated circuit includes a first conductive lead, a second conductive lead and a third conductive lead. A first resistive region is connected between the first conductive lead and the third conductive lead. A second resistive region is connected between the second conductive lead and the third conductive lead. A side formed by the first conductive lead and the first resistive region is parallel to a side formed by the second conductive lead and the second resistive region.

Abstract: A switching element includes a bubble chamber, a heater and a heat conductor. The bubble chamber holds fluid. The bubble chamber includes a trench within a planar light circuit and includes a trench within an integrated circuit attached to the planar light circuit. The heater is located under the trench within the integrated circuit. The heat conductor is attached to the integrated circuit. The heat conductor is located within the trench within the integrated circuit. A portion of the heat conductor is in close proximity to the heater. The heat conductor is more heat conductive than the fluid within the bubble chamber.

Abstract: A silicon chip is attached to a planar light circuit. A recessed moat is formed around an output perimeter of a surface of the silicon chip. When soldering the silicon chip to the planar light circuit, the recessed moat is filled with solder.

Abstract: A silicon chip is attached to a planar light circuit. A recessed moat is formed around an output perimeter of a surface of the silicon chip. When soldering the silicon chip to the planar light circuit, the recessed moat is filled with solder.

Abstract: A switching element includes a bubble chamber, a heater and a heat conductor. The bubble chamber holds fluid. The bubble chamber includes a trench within a planar light circuit and includes a trench within an integrated circuit attached to the planar light circuit. The heater is located under the trench within the integrated circuit. The heat conductor is attached to the integrated circuit. The heat conductor is located within the trench within the integrated circuit. A portion of the heat conductor is in close proximity to the heater. The heat conductor is more heat conductive than the fluid within the bubble chamber.

Abstract: A heating device within an integrated circuit includes a first conductive lead, a second conductive lead and a third conductive lead. A first resistive region is connected between the first conductive lead and the third conductive lead. A second resistive region is connected between the second conductive lead and the third conductive lead. A side formed by the first conductive lead and the first resistive region is parallel to a side formed by the second conductive lead and the second resistive region.

Abstract: An opto-fluidic device includes a logic and heater layer placed on a top of a substrate layer. The logic and heater layer includes both a logic circuitry region and a heater region. The heater region includes a resistor used as a heater. A liquid containment region is located below the substrate layer. The liquid containment region includes a trench that is situated below the heater region so that the heater can be used to heat liquid contained within the trench.

Abstract: A switching element includes a bubble chamber, a heater and a heat conductor. The bubble chamber holds fluid. The bubble chamber includes a trench within a planar light circuit and includes a trench within an integrated circuit attached to the planar light circuit. The heater is located under the trench within the integrated circuit. The heat conductor is attached to the integrated circuit. The heat conductor is located within the trench within the integrated circuit. A portion of the heat conductor is in close proximity to the heater. The heat conductor is more heat conductive than the fluid within the bubble chamber.

Abstract: An integrated circuit is joined to a liquid container. The integrated circuit includes a passivation layer. A resistor is used as a heater to heat fluid in a liquid container. A mesa structure is formed over the passivation layer. The mesa structure is in contact with the resistor and is used to more effectively deliver heat from the resistor to the liquid container.

Abstract: A silicon chip is attached to a planar light circuit. A recessed moat is formed around an output perimeter of a surface of the silicon chip. When soldering the silicon chip to the planar light circuit, the recessed moat is filled with solder.

Abstract: Fluid within a reflection optical switch system is purified. Gettering structures are placed within a chamber within the reflection optical switch system. The gettering structures includes heating components which when actuated attract impurities. The heating components within the gettering structures are turned on to getter out impurities from fluid within the chamber.

Abstract: Sound signals are detected. Light signals are generated that pass through a membrane of a bubble within a trench. The sound signals cause deformations within the membrane of the bubble. The light signals are detected after the light signals have passed through the membrane. The sound signals are reconstructed from the light signals detected by the optical detector.

Abstract: The optical switch operates in two stages. In the first stage, the bubble is “blown” into the trench. In the second stage, the sidewalls are heated to achieve a dry wall condition by improving the thermal transfer path from the heat source to the reflecting wall. Separate side heaters are placed in thermal contact to the sidewalls. This results in a switch that is more stable, energy efficient, and has a longer mean time to failure.

Abstract: The optical switch operates in two stages. In the first stage, the bubble is “blown” into the trench. In the second stage, the sidewalls are heated to achieve a dry wall condition by improving the thermal transfer path from the heat source to the reflecting wall. Seperate side heaters are placed in thermal contact to the sidewalls. This results in a switch that is more stable, energy efficient, and has a longer mean time to failure.

Abstract: This present invention is embodied in a system and a method for protecting an electrically-inactive component of a microsystem from an ESD event. The invention includes embodiments that protect the microsystem from ESD events that directly strike an electrically-inactive component and that are external to the electrically-inactive component. The present invention includes an ESD dissipation device having a connected chain of electrically-inactive components that are electrically floating. Alternatively, the electrically-inactive components can be held at the same potential as an electrical component. Further, a sacrificial ESD breakdown device is included that provides a preferential ESD breakdown site away from the protected component. Also, capacitively coupled thin-film layers can provide shielding to electrically-inactive components.