Abstract: A technique for actively shielding a signal such that a signal driver of the signal only participates in discharge events is provided. Because the signal driver only participates in discharge events, the signal driver is non-interacting with respect to other driver devices. Shield wires are set such that an active transition on the signal causes a discharge of capacitance between the signal and the shield wires.

Abstract: A technique for verifying on-chip decoupling capacitance using transistor and capacitor surface area information is provided. The technique broadly includes determining a surface area of a transistor, determining a surface area of a decoupling capacitor, comparing the surface area of the transistor to the surface area of the decoupling capacitor to obtain a surface area ratio, and verifying whether there is enough decoupling capacitance based on the surface area ratio. Further, the present invention also provides a technique for determining when and how to redesign a microprocessor in order to have sufficient decoupling capacitance.

Abstract: A current crowding reduction technique that uses slots positioned between vias and a bump on a metal layer is provided. The presence of slots between the vias and the bump allows current path lengths from the vias to the bump to made substantially equal. Because the current paths have substantially equal current flow among them when the current path lengths are substantially equal, current flows from the vias to the bump in a more uniform manner. Further, a bump and vias structure that uses slots disposed in between vias and a bump is also provided. Further, a method for designing a metal layer having slots positioned in between vias and a bump is also provided.

Abstract: A technique for reducing current crowding on a bump using selective current injection is provided. The technique allows a bump to more uniformly inject current around the bump from vias on a metal layer, where the vias are concentrated on outer regions of the metal layer and have higher via density than that of a central region of vias on the metal layer. Because vias are concentrated on the outer regions of the metal layer, higher current distribution density along current flow paths from the outer regions to the bump compensates for a shorter current path length from the central region to the bump, thus effectively reducing current crowding on the bump. Further, a technique for selectively positioning regions of vias on a metal layer in order to reduce current crowding on a bump is provided.

Abstract: A 180 degree bump placement layout for an integrated circuit power grid is provided. This layout improves integrated circuit performance and reliability and gives an integrated circuit designer added flexibility and uniformity in designing the integrated circuit. Further, a patterned bump array for a top metal layer of an integrated circuit having a plurality of 180 degree bump placement structures is provided.

Abstract: A method for preferentially shielding a signal to increase implicit decoupling capacitance is provided. The signal is preferentially shielded by using a probability of the signal being at a specific value to assign a shield potential. Further, an integrated circuit that preferentially shields a signal to increase decoupling capacitance by using a probability of the signal being at a specific value to assign a shield potential is provided. Further, a computer system for preferentially shielding a signal to increase decoupling capacitance by using a probability of the signal being at a specific value to assign a shield potential is provided. Further, a computer readable medium having executable instructions for preferentially shielding a signal to increase implicit decoupling capacitance by using a probability of the signal being at a specific value to assign a shield potential is provided. Further, a method to increase system performance by increasing implicit decoupling capacitance is provided.

Abstract: A decoupling capacitor assignment technique that increases decoupling capacitance without violating a leakage power constraint of an integrated circuit is provided. The decoupling capacitor assignment technique selectively replaces decoupling capacitors associated with high driver decoupling capacitance need to available decoupling capacitance ratios with thin-oxide decoupling capacitors such that decoupling capacitance is increased and the leakage power constraint is met.

Abstract: An integrated circuit that preferentially shields a signal to increase decoupling capacitance is provided. The signal is preferentially shielded based on a probability of the signal being at a specific value. Further, a method for increasing an amount of decoupling capacitance on a circuit through preferential shielding is provided. Further, a method to increase system performance by increasing implicit decoupling capacitance is provided.

Abstract: A method that preferentially shields a signal to increase decoupling capacitance is provided. The signal is preferentially shielded based on a probability of the signal being at a specific value. Because the shield may also be used to form the power and ground grid, a balanced number of power versus ground lines is desired. A method for inverting the signal to balance the number of power versus ground lines is provided. Further, a method to increase system performance by increasing implicit decoupling capacitance is provided.

Abstract: A technique for verifying decoupling capacitance using a maximum flow determination is provided. The technique involves generating a network representing decoupling capacitors and driver elements on an integrated circuit, selectively establishing connections between decoupling capacitors and driver elements, and determining a maximum flow of the network. Using the maximum flow of the network, a designer may then verify whether particular driver elements are receiving sufficient decoupling capacitance and whether particular decoupling capacitors are being used efficiently, and subsequently redesign an integrated circuit as deemed necessary.

Abstract: A method for preferentially shielding a signal to increase implicit decoupling capacitance is provided. The signal is preferentially shielded by using a probability of the signal being at a specific value to determine where to route the signal. Further, an integrated circuit that preferentially shields a signal to increase decoupling capacitance by using a probability of the signal being at a specific value to determine where to route the signal. Further, a computer system for preferentially shielding a signal to increase decoupling capacitance by using a probability of the signal being at a specific value to determine where to route the signal. Further, a computer readable medium having executable instructions for preferentially shielding a signal to increase implicit decoupling capacitance by using a probability of the signal being at a specific value to determine where to route the signal.

Abstract: A 180 degree bump placement layout for an integrated circuit power grid is provided. This layout improves integrated circuit performance and reliability and gives an integrated circuit designer added flexibility and uniformity in designing the integrated circuit. Further, a patterned bump array for a top metal layer of an integrated circuit having a plurality of 180 degree bump placement structures is provided.

Abstract: A 150 degree bump placement layout for an integrated circuit power grid is provided. This layout improves integrated circuit performance and reliability and gives an integrated circuit designer added flexibility and uniformity in designing the integrated circuit. Further, a patterned bump array for a top metal layer of an integrated circuit having a plurality of 150 degree bump placement structures is provided.

Abstract: A current crowding reduction technique involving the uniform displacement of vias around a bump is provided. By uniformly arranging vias around the bump on an integrated circuit, current can uniformly flow to and from the bump, effectively leading to reduced current density around the bump. Further, a method for reducing current crowding around a bump using an uniform arrangement of vias around the bump is provided.

Abstract: An integrated circuit having a clock driver connected to a non-peripheral region of a clock grid is provided. Providing interconnect that connect a clock driver to non-peripheral regions the clock grid effectively leads to reduced clock skew due to reduced RC delays from clock grid connection points to components operatively connected to the clock grid. Further, a method for reducing clock skew on a clock grid using a wire tree architecture structure is provided.

Abstract: A 120 degree bump placement layout for an integrated circuit power grid is provided. This layout improves integrated circuit performance and reliability and gives an integrated circuit designer added flexibility and uniformity in designing the integrated circuit. Further, a patterned bump array for a top metal layer of an integrated circuit having a plurality of 120 degree bump placement structures is provided.

Abstract: A technique for verifying on-chip decoupling capacitance using transistor and capacitor surface area information is provided. The technique broadly includes determining a surface area of a transistor, determining a surface area of a decoupling capacitor, comparing the surface area of the transistor to the surface area of the decoupling capacitor to obtain a surface area ratio, and verifying whether there is enough decoupling capacitance based on the surface area ratio. Further, the present invention also provides a technique for determining when and how to redesign a microprocessor in order to have sufficient decoupling capacitance.

Abstract: A current crowding reduction technique involving the uniform displacement of vias around a bump is provided. By uniformly arranging vias around the bump on an integrated circuit, current can uniformly flow to and from the bump, effectively leading to reduced current density around the bump. Further, a method for reducing current crowding around a bump using an uniform arrangement of vias around the bump is provided.

Abstract: A method for reducing noise in an I/O system has been developed. The method includes powering up the I/O supply and activating or inserting a shunting resistance across the power supply terminals. The shunting resistance is inserted in parallel with the I/O power supply, and is controllable such that the resistance can be selectively switched ‘on’ and/or ‘off.

Abstract: A method and apparatus for assigning decoupling capacitors on an integrated circuit such that leakage power is minimized is provided. Particularly, the method and apparatus use an available capacitance area of an integrated circuit, a capacitance requirement of the integrated circuit, an available thin-oxide capacitance amount, and an available thick-oxide capacitance amount to generate an assignment that indicates what percentage of the available capacitance area should be filled with thin-oxide capacitors and what percentage of the available capacitance area should be filled with thick-oxide capacitors in order to meet the capacitance requirement and minimize leakage power attributable to the thin-oxide and thick-oxide capacitors.