Abstract: A soldering tip is provided with a protrusion extending from its operative region to permit an opening to extend therethrough. Thermocouple wires are disposed in the opening and mechanically urged into thermal contact with the operative region. One embodiment of the present invention provides a protrusion extending from the central region of the soldering tip which is deformed by compression after thermocouple wires are inserted into an opening extending through the protrusion. An alternative embodiment of the present invention incorporates two protrusions to define a gap therebetween into which the thermocouple wires can be disposed. After disposing the wires in the gap, an annular member is placed around both protrusions and a spring urges the annular member downward to press the thermocouple against the bottom of the gap and in thermal contact with the central region of the soldering tip.