Abstract: A sample analysis system is available that can include a remote sampling system, at least one analyzer, and a controller. The remote sampling system can include a plurality of sample sources for providing a corresponding sample therefrom; and a plurality of sample collection devices selectively coupled to any of the plurality of sample sources for receiving at least one of the samples therefrom. The at least one analyzer can be coupled to the plurality of the sample collection devices for receiving at least one of the samples therefrom. The controller can be coupled with the remote sampling system and the at least one analyzer, the controller configured to control which of the sample sources is actively coupled to a given sample collection device at a given time.

Abstract: Systems and methods are described for isolating a sample at a valve prior to introduction to an analysis system, such as sample analysis via ICP-MS. A system embodiment can include, but is not limited to, a valve system including a first valve in fluid communication with a sample reservoir and a second valve configured to permit and block access of a vacuum source to the first valve; a sensor system configured to detect presence or absence of a fluid at the first valve; and a controller configured to control operation of the second valve to block access of the vacuum source to the first valve upon detection of the fluid at the first valve to isolate the fluid within the sample reservoir.

Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.

Abstract: Systems and methods are described for preventing the release of metal particles from an autosampler that could otherwise be detected within a sample during sample analysis. In an example implementation, an autosampler systems includes, but is not limited to, a sample probe support structure; a z-axis support; an outer shuttle coupled with an outer surface of the z-axis support; and an inner shuttle linearly moveable within an interior volume of the z-axis support, the inner shuttle magnetically coupled with the outer shuttle to translate linear motion of the inner shuttle to the outer shuttle.

Abstract: A sample analysis system is available that can include a remote sampling system, at least one analyzer, and a controller. The remote sampling system can include a plurality of sample sources for providing a corresponding sample therefrom; and a plurality of sample collection devices selectively coupled to any of the plurality of sample sources for receiving at least one of the samples therefrom. The at least one analyzer can be coupled to the plurality of the sample collection devices for receiving at least one of the samples therefrom. The controller can be coupled with the remote sampling system and the at least one analyzer, the controller configured to control which of the sample sources is actively coupled to a given sample collection device at a given time.

Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.

Abstract: Systems and methods are described for isolating a sample at a valve prior to introduction to an analysis system, such as sample analysis via ICP-MS. A system embodiment can include, but is not limited to, a valve system including a first valve in fluid communication with a sample reservoir and a second valve configured to permit and block access of a vacuum source to the first valve; a sensor system configured to detect presence or absence of a fluid at the first valve; and a controller configured to control operation of the second valve to block access of the vacuum source to the first valve upon detection of the fluid at the first valve to isolate the fluid within the sample reservoir.

Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.

Abstract: A sample identification system for an automated sampling device is described. A system embodiment includes, but is not limited to, a sample holder having a plurality of apertures configured to receive a plurality of sample vessels therein, the sample holder having one or more corresponding sample holder identifiers positioned proximate to the sample holder; and an identifier capture device configured to detect the one or more sample holder identifiers positioned proximate to the sample holder and generate a data signal in response thereto, the data signal corresponding to at least an orientation of the sample holder relative to a surface on which the sample holder is positioned.

Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.

Abstract: Valve assemblies are described that provide magnetic coupling between a valve actuator and a valve body housing the valve rotor and stator. A valve assembly embodiment, includes, but is not limited to, a valve body, the valve body including at least one magnet, and a rotor and a stator configured to define a plurality of fluid flow passageways; a valve actuator configured to drive the rotor via a drive shaft; and an actuator mount coupled to the valve actuator and configured to magnetically couple with the at least one magnet of the valve body to magnetically couple the valve body and the valve actuator.

Abstract: Systems and methods for automated cap removal with an autosampler system are described. In an aspect, an autosampler system includes, but is not limited to, a sample rack; a sample vessel stabilizer configured to transition the sample rack between a load/unload state and a lock state; an uncapper supported by a first z-axis support; and a sample probe supported by a second z-axis support, wherein the uncapper is configured to remove a cap from a sample vessel held by the sample rack when the sample rack is in the lock state, and wherein the uncapper is configured to change the position of the removed cap to permit access to an interior of the sample vessel by the sample probe without removing the sample vessel from the sample rack.

Abstract: An ultrapure water (UPW) generation and verification system can include a cleaning chemical station, a cleanup column, a conductivity verification station, and a holding reservoir, in fluid communication with one another. The cleaning chemical station can be configured to selectably permit a flow of water to pass therethrough to the cleanup column or to block the flow of water and instead deliver a cleaning chemical to the cleanup column. The conductivity verification station can be configured to selectably perform at least one of the following: permit water to flow from the cleanup column to the holding reservoir; direct fluid to waste; or test the conductivity of the water for a purity level.

Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.

Abstract: Systems and methods are described to determine whether a sample transmitted through a transfer line from a remote sampling system contains a suitable sample to analyze by an analysis system. A system embodiment includes, but is not limited to, a sample receiving line configured to receive a liquid segment a first detector configured to detect the liquid segment at a first location in the sample receiving line; a second detector configured to detect the liquid segment at a second location in the sample receiving line downstream from the first location; and a controller configured to register a continuous liquid segment in the sample receiving line when the first detector and the second detector match detection states prior to the controller registering a change of state of the first detector.

Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.

Abstract: A sample identification system for an automated sampling device is described. A system embodiment includes, but is not limited to, a sample holder having a plurality of apertures configured to receive a plurality of sample vessels therein, the sample holder having one or more corresponding sample holder identifiers positioned proximate to the sample holder; and an identifier capture device configured to detect the one or more sample holder identifiers positioned proximate to the sample holder and generate a data signal in response thereto, the data signal corresponding to at least an orientation of the sample holder relative to a surface on which the sample holder is positioned.

Abstract: Systems and methods are described for heating sample transfer lines between a source of a sample and a detection system to detect analytes of interest in the sample, where the sample is maintained in a heated state to maintain dissolved analytes of interest in solution.

Abstract: Systems and methods are described to determine whether a sample transmitted through a transfer line from a remote sampling system contains a suitable sample to analyze by an analysis system. A system embodiment includes, but is not limited to, a sample receiving line configured to receive a liquid segment a first detector configured to detect the liquid segment at a first location in the sample receiving line; a second detector configured to detect the liquid segment at a second location in the sample receiving line downstream from the first location; and a controller configured to register a continuous liquid segment in the sample receiving line when the first detector and the second detector match detection states prior to the controller registering a change of state of the first detector.

Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.