Patents by Inventor Tyrone Jon Donato Soller

Tyrone Jon Donato Soller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip package and method of manufacturing the same
    Patent number: 9698086
    Abstract: Embodiments provide provides a chip package. The chip package may include a leadframe having a die pad and a plurality of lead fingers; a first chip attached to the die pad, the first chip being bonded to one or more of the lead fingers via a first set of wire bonds; a second chip bonded to one or more of the lead fingers via flip chip; and a heat slug attached to the second chip.
    Type: Grant
    Filed: June 17, 2014
    Date of Patent: July 4, 2017
    Assignee: INFINEON TECHNOLOGIES AG
    Inventor: Tyrone Jon Donato Soller
  • Packages for multiple semiconductor chips
    Patent number: 9147600
    Abstract: In accordance with an embodiment of the present invention, a semiconductor device has a substrate having a first surface and a second surface opposite the first surface. Also, the substrate has a first hole. A plurality of leads is disposed over the first surface of the substrate and a die paddle is disposed in the first hole. Additionally, an encapsulant is disposed on the die paddle and the plurality of leads.
    Type: Grant
    Filed: January 3, 2013
    Date of Patent: September 29, 2015
    Assignee: Infineon Technologies AG
    Inventor: Tyrone Jon Donato Soller
  • CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20140291823
    Abstract: Embodiments provide provides a chip package. The chip package may include a leadframe having a die pad and a plurality of lead fingers; a first chip attached to the die pad, the first chip being bonded to one or more of the lead fingers via a first set of wire bonds; a second chip bonded to one or more of the lead fingers via flip chip; and a heat slug attached to the second chip.
    Type: Application
    Filed: June 17, 2014
    Publication date: October 2, 2014
    Inventor: Tyrone Jon Donato Soller
  • Semiconductor Device and Method of Making a Semiconductor Device
    Publication number: 20140183711
    Abstract: In accordance with an embodiment of the present invention, a semiconductor device has a substrate having a first surface and a second surface opposite the first surface. Also, the substrate has a first hole. A plurality of leads is disposed over the first surface of the substrate and a die paddle is disposed in the first hole. Additionally, an encapsulant is disposed on the die paddle and the plurality of leads.
    Type: Application
    Filed: January 3, 2013
    Publication date: July 3, 2014
    Applicant: INFINEON TECHNOLOGIES AG
    Inventor: Tyrone Jon Donato Soller
  • Chip package and method of manufacturing the same
    Patent number: 8759956
    Abstract: Embodiments provide provides a chip package. The chip package may include a leadframe having a die pad and a plurality of lead fingers; a first chip attached to the die pad, the first chip being bonded to one or more of the lead fingers via a first set of wire bonds; a second chip bonded to one or more of the lead fingers via flip chip; and a heat slug attached to the second chip.
    Type: Grant
    Filed: July 5, 2012
    Date of Patent: June 24, 2014
    Assignee: Infineon Technologies AG
    Inventor: Tyrone Jon Donato Soller
  • CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20140008776
    Abstract: Embodiments provide provides a chip package. The chip package may include a leadframe having a die pad and a plurality of lead fingers; a first chip attached to the die pad, the first chip being bonded to one or more of the lead fingers via a first set of wire bonds; a second chip bonded to one or more of the lead fingers via flip chip; and a heat slug attached to the second chip.
    Type: Application
    Filed: July 5, 2012
    Publication date: January 9, 2014
    Applicant: INFINEON TECHNOLOGIES AG
    Inventor: Tyrone Jon Donato Soller