Patents by Inventor TYRONE TUNG HUANG

TYRONE TUNG HUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SHARING PACKAGE PINS IN A MULTI-CHIP MODULE (MCM)
    Publication number: 20240126712
    Abstract: A semiconductor package includes multiple dies that share the same package pin. An output enable register provided on each die is used to select the die that drives an output to the shared pin. A hardware arbitration circuit ensures that two or more dies do not drive an output to the shared pin at the same time.
    Type: Application
    Filed: December 21, 2023
    Publication date: April 18, 2024
    Inventors: YULEI SHEN, TYRONE TUNG HUANG, CHEN-KUAN HONG
  • Sharing package pins in a multi-chip module (MCM)
    Patent number: 11886370
    Abstract: A semiconductor package includes multiple dies that share the same package pin. An output enable register provided on each die is used to select the die that drives an output to the shared pin. A hardware arbitration circuit ensures that two or more dies do not drive an output to the shared pin at the same time.
    Type: Grant
    Filed: May 13, 2022
    Date of Patent: January 30, 2024
    Assignees: ADVANCED MICRO DEVICES, INC., ATI TECHNOLOGIES ULO
    Inventors: Yulei Shen, Tyrone Tung Huang, Chen-Kuan Hong
  • SHARING PACKAGE PINS IN A MULTI-CHIP MODULE (MCM)
    Publication number: 20230367730
    Abstract: A semiconductor package includes multiple dies that share the same package pin. An output enable register provided on each die is used to select the die that drives an output to the shared pin. A hardware arbitration circuit ensures that two or more dies do not drive an output to the shared pin at the same time.
    Type: Application
    Filed: May 13, 2022
    Publication date: November 16, 2023
    Inventors: YULEI SHEN, TYRONE TUNG HUANG, CHEN-KUAN HONG