Patents by Inventor Tysir Khourshid

Tysir Khourshid has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190002732
    Abstract: A mold release composition is provided contains a minimum of three reactive moieties per molecule to provide for both mold adhesion and crosslink density. The composition is soluble in a VOC-free organic solvent or water, alone or with resort to an emulsifier. The composition can be used as a semi-permanent mold release in some embodiments.
    Type: Application
    Filed: September 6, 2018
    Publication date: January 3, 2019
    Inventors: Tysir Khourshid, Douglas E. Moon
  • Patent number: 10113084
    Abstract: A mold release composition is provided contains a minimum of three reactive moieties per molecule to provide for both mold adhesion and crosslink density. The composition is soluble in a VOC-free organic solvent or water, alone or with resort to an emulsifier. The composition can be used as a semi-permanent mold release in some embodiments.
    Type: Grant
    Filed: April 14, 2015
    Date of Patent: October 30, 2018
    Assignee: Illinois Tool Works, Inc.
    Inventors: Tysir Khourshid, Douglas E. Moon
  • Publication number: 20150337172
    Abstract: A mold release composition is provided contains a minimum of three reactive moieties per molecule to provide for both mold adhesion and crosslink density. The composition is soluble in a VOC-free organic solvent or water, alone or with resort to an emulsifier. The composition can be used as a semi-permanent mold release in some embodiments.
    Type: Application
    Filed: April 14, 2015
    Publication date: November 26, 2015
    Inventors: Tysir Khourshid, Douglas E. Moon