Abstract: Methods of bonding plastics are described herein. The method includes providing a substrate having a melting temperature in a first range, providing a bonding film having a melting temperature in the first range, providing an adhesive layer, providing an optical film having a melting temperature in a second range, laminating the bonding film, the adhesive layer, and optical film together, and bonding the laminate to the substrate. Another method includes providing the substrate and the optical film, coating the substrate with a thermal matching layer having a melting temperature in the second range, or coating the optical film with a thermal matching layer having a melting temperature in the first range, and bonding the thermal matching layer to the substrate or the optical film that is uncoated with the thermal matching layer. A difference between melting temperatures of the substrate and the optical film is about 50 to 250° F.

Abstract: Methods of bonding plastics are described herein. The method includes providing a substrate having a melting temperature in a first range, providing a bonding film having a melting temperature in the first range, providing an adhesive layer, providing an optical film having a melting temperature in a second range, laminating the bonding film, the adhesive layer, and optical film together, and bonding the laminate to the substrate. Another method includes providing the substrate and the optical film, coating the substrate with a thermal matching layer having a melting temperature in the second range, or coating the optical film with a thermal matching layer having a melting temperature in the first range, and bonding the thermal matching layer to the substrate or the optical film that is uncoated with the thermal matching layer. A difference between melting temperatures of the substrate and the optical film is about 50 to 250° F.

Abstract: In an aspect there is provided a connector device. The connector device may include a cable connector having a housing having an opening at a first end and a cable gland at a second end; and a sleeve having an internal channel configured to interchangeably couple with an electrical transceiver module type and an optical transceiver module type. The internal channel may extend between a first end and a second end of the sleeve. The first end of the sleeve may be configured to insert through the opening in the housing to releasably couple the sleeve to the housing. The second end of the sleeve may be configured to insert through a port on a unit and couple the electrical transceiver to an edge connector on a printed circuit board (PCB) when the electrical transceiver is coupled with the sleeve. The second end of the sleeve may be further configured to insert through the port on the unit and couple the optical transceiver to the edge connector on the PCB when the optical transceiver is coupled with the sleeve.

Abstract: In an aspect there is provided a connector device. The connector device may include a cable connector having a housing having an opening at a first end and a cable gland at a second end; and a sleeve having an internal channel configured to interchangeably couple with an electrical transceiver module type and an optical transceiver module type. The internal channel may extend between a first end and a second end of the sleeve. The first end of the sleeve may be configured to insert through the opening in the housing to releasably couple the sleeve to the housing. The second end of the sleeve may be configured to insert through a port on a unit and couple the electrical transceiver to an edge connector on a printed circuit board (PCB) when the electrical transceiver is coupled with the sleeve. The second end of the sleeve may be further configured to insert through the port on the unit and couple the optical transceiver to the edge connector on the PCB when the optical transceiver is coupled with the sleeve.