Patents by Inventor Tyson L. Ringold

Tyson L. Ringold has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HIGH-HARDNESS-MATERIAL-POWDER INFUSED ELASTOMER FOR HIGH FRICTION AND COMPLIANCE FOR SILICON WAFER TRANSFER
    Publication number: 20170040205
    Abstract: Disclosed herein, a contact pad for use on a robot arm in transfer chamber in a wafer processing tool is provided, comprising an elastomer body and a high hardness powder doping a surface of the elastomer body.
    Type: Application
    Filed: July 26, 2016
    Publication date: February 9, 2017
    Inventors: Jacob L. Hiester, Richard M. Blank, Tyson L. Ringold, Peter J. Woytowitz, Mohsen S. Salek