Patents by Inventor Tyson Lee Ringold

Tyson Lee Ringold has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Smart vibration wafer with optional integration with semiconductor processing tool
    Patent number: 10509052
    Abstract: A test wafer having two spaced-apart accelerometers mounted thereon is disclosed. The accelerometers may be positioned at locations located along a common axis passing through the center of gravity of the test wafer. The test wafer may include a controller that may be used to transmit acceleration data collected by the accelerometers to another device. In some implementations, a semiconductor processing tool is provided that includes a test wafer receptacle for storing a test wafer that remains with the semiconductor processing tool and that may be retrieved by a wafer handling robot for performing a test cycle during periods when the wafer handling robot is not performing substrate transport operations.
    Type: Grant
    Filed: February 6, 2017
    Date of Patent: December 17, 2019
    Assignee: Lam Research Corporation
    Inventors: Peter S. Thaulad, Arulselvam Simon Jeyapalan, Richard M. Blank, Tyson Lee Ringold, Victor Eduardo Espinosa, III
  • SMART VIBRATION WAFER WITH OPTIONAL INTEGRATION WITH SEMICONDUCTOR PROCESSING TOOL
    Publication number: 20180224500
    Abstract: A test wafer having two spaced-apart accelerometers mounted thereon is disclosed. The accelerometers may be positioned at locations located along a common axis passing through the center of gravity of the test wafer. The test wafer may include a controller that may be used to transmit acceleration data collected by the accelerometers to another device. In some implementations, a semiconductor processing tool is provided that includes a test wafer receptacle for storing a test wafer that remains with the semiconductor processing tool and that may be retrieved by a wafer handling robot for performing a test cycle during periods when the wafer handling robot is not performing substrate transport operations.
    Type: Application
    Filed: February 6, 2017
    Publication date: August 9, 2018
    Inventors: Peter S. Thaulad, Arulselvam Simon Jeyapalan, Richard M. Blank, Tyson Lee Ringold, Victor Eduardo Espinosa, III
  • Elevator for promoting extraction of blood sample from dried blood sample paper
    Patent number: D974587
    Type: Grant
    Filed: January 20, 2021
    Date of Patent: January 3, 2023
    Assignee: VDI Laboratory, LLC
    Inventors: Randy Ringold, Tyson Lee Ringold