Abstract: Structures, architectures, systems, an integrated circuit, methods and software for configuring an integrated circuit for multiple packaging types and/or selecting a packaging type for an integrated circuit. A structure generally includes a bump pad having a plurality of electrically disconnected bump pad sections, a plurality of bond pads each configured for electrical connection to one of the bump pad sections, and a plurality of conductive traces, each adapted to electrically connect one of the bond pads to the one bump pad section. A method generally includes the steps of forming the bump pad, the bond pads, and the conductive traces from an uppermost metal layer, and forming an insulation layer thereover. Another method generally includes forming the uppermost metal layer, and forming either a wire bond to at least one of the bond pads, or a ball bond or solder ball to electrically connect the bump pad section.

Abstract: A system including a component of a transceiver, a comparator, a counter, and a calibration circuit. The component receives an input signal comprising packets and based on the input signal, generates output signals to transmit the packets. The comparator compares the output signals to generate a comparison signal. The counter counts cycles of a clock signal to provide a count value. The control device, based on the comparison signal, transitions the counter between incrementing the count value and decrementing the count value. The calibration circuit operates in first and second calibration modes; during the first calibration mode, calibrates the component until the counter transitions a predetermined number of times between incrementing the count value and decrementing the count value; and during the second calibration mode, calibrates the component until (i) the counter transitions between incrementing and decrementing the count value, or (ii) counts a predetermined number of cycles.

Abstract: Structures, architectures, systems, an integrated circuit, methods and software for configuring an integrated circuit for multiple packaging types and/or selecting one of a plurality of packaging types for an integrated circuit. The structure generally comprises a bump pad, a plurality of bond pads configured for independent electrical connection to the bump pad, and a plurality of conductive traces, each adapted to electrically connect one of the bond pads to the bump pad. The method of configuring generally includes the steps of forming the bump pad, the bond pads, and the conductive traces from an uppermost metal layer, and forming an insulation layer thereover. The method of selecting generally comprises the uppermost metal layer-forming step, and forming either (i) a wire bond to at least one of the bond pads, or (ii) a bumping metal configured to electrically connect at least one of the bond pads to the bump pad.

Abstract: A transceiver including a transceiver component with a first and second inputs and an output. The transceiver is configured to (i) receive an input signal having packets via the first input and (ii) generate output signals at the output based on the input signal. The transceiver further includes a first comparator configured to compare the output signals and generate a first comparison signal; a register configured to store the first comparison signal; a calibration circuit is configured to generate a current signal based on the first comparison signal to adjust a current in the transceiver component; and a signal generator is configured to generate a reference signal based on the current signal. The transceiver component is configured to (i) based on the current signal, adjust a performance parameter of the transceiver at times synchronized with the packets and (ii) generate the output signals based on the current signal and the reference signal.

Abstract: Structures, architectures, systems, an integrated circuit, methods and software for configuring an integrated circuit for multiple packaging types and/or selecting one of a plurality of packaging types for an integrated circuit. The structure generally comprises a bump pad, a plurality of bond pads configured for independent electrical connection to the bump pad, and a plurality of conductive traces, each adapted to electrically connect one of the bond pads to the bump pad. The software is generally configured to place and route components of such a structure. The method of configuring generally includes the steps of forming the bump pad, the bond pads, and the conductive traces from an uppermost metal layer, and forming an insulation layer thereover. The method of selecting generally comprises the uppermost metal layer-forming step, and forming either (i) a wire bond to at least one of the bond pads, or (ii) a bumping metal configured to electrically connect at least one of the bond pads to the bump pad.

Abstract: Structures, architectures, systems, an integrated circuit, methods and software for configuring an integrated circuit for multiple packaging types and/or selecting one of a plurality of packaging types for an integrated circuit. The structure generally comprises a bump pad having a plurality of electrically disconnected bump pad sections, a plurality of bond pads each configured for electrical connection to one of the bump pad sections, and a plurality of conductive traces, each adapted to electrically connect one of the bond pads to the one bump pad section. The software is generally configured to place and route components of such a structure. The method of configuring generally includes the steps of forming the bump pad, the bond pads, and the conductive traces from an uppermost metal layer, and forming an insulation layer thereover.

Abstract: A method for detecting a security breach in a network comprises at one of a plurality of transceivers each having a different media access control address, receiving a signal from an access point, the signal representing one or more packets of data, determining a source media access control address for each of the packets, and alerting the access point when the source media access control address of one of the packets is the media access control address of the transceiver.

Abstract: Structures, architectures, systems, an integrated circuit, methods and software for configuring an integrated circuit for multiple packaging types and/or selecting one of a plurality of packaging types for an integrated circuit. The structure generally comprises a bump pad, a plurality of bond pads configured for independent electrical connection to the bump pad, and a plurality of conductive traces, each adapted to electrically connect one of the bond pads to the bump pad. The software is generally configured to place and route components of such a structure. The method of configuring generally includes the steps of forming the bump pad, the bond pads, and the conductive traces from an uppermost metal layer, and forming an insulation layer thereover. The method of selecting generally comprises the uppermost metal layer-forming step, and forming either (i) a wire bond to at least one of the bond pads, or (ii) a bumping metal configured to electrically connect at least one of the bond pads to the bump pad.

Abstract: A method for detecting a security breach in a network comprises at one of a plurality of transceivers each having a different media access control address, receiving a signal from an access point, the signal representing one or more packets of data, determining a source media access control address for each of the packets, and alerting the access point when the source media access control address of one of the packets is the media access control address of the transceiver.

Abstract: A packet-based wireless transceiver that transmits and receives data packets comprises a receiver including a mixer that converts signal frequencies and a baseband circuit that communicates with the mixer and that includes an amplifier. A receiver voltage offset calibration circuit adjusts a receiver voltage offset at the baseband circuit at times synchronized with the data packets and includes a calibration signal generator that outputs calibration signals to first and second inputs of the baseband circuit and a calibration adjustment circuit that communicates with the calibration signal generator and that adjusts the calibration signal to reduce the voltage offset based on an output of the amplifier.

Abstract: Structures, architectures, systems, an integrated circuit, methods and software for configuring an integrated circuit for multiple packaging types and/or selecting one of a plurality of packaging types for an integrated circuit. The structure generally comprises a bump pad, a plurality of bond pads configured for independent electrical connection to the bump pad, and a plurality of conductive traces, each adapted to electrically connect one of the bond pads to the bump pad. The software is generally configured to place and route components of such a structure. The method of configuring generally includes the steps of forming the bump pad, the bond pads, and the conductive traces from an uppermost metal layer, and forming an insulation layer thereover. The method of selecting generally comprises the uppermost metal layer-forming step, and forming either (i) a wire bond to at least one of the bond pads, or (ii) a bumping metal configured to electrically connect at least one of the bond pads to the bump pad.

Abstract: A method, apparatus, and computer-readable media for detecting a security breach in a network comprising an access point and a plurality of transceivers each having a different media access control address comprises, at one of the transceivers, receiving a signal from the access point, the signal representing one or more packets of data; determining a source media access control address for each of the packets; and transmitting an alert packet to the access point when the source media access control address of one of the packets is the media access control address of the transceiver.

Abstract: A packet-based wireless transceiver that transmits and receives data packets includes a transceiver component having an adjustable performance parameter. A calibration circuit adjusts the performance parameter of the transceiver component at times synchronized with the data packets. A calibration signal generator generates calibration signals based on the performance parameter and outputs the calibration signals to the transceiver component. A comparator receives the outputs of the transceiver component and generates a difference signal. A calibration adjustment circuit communicates with the calibration signal generator and the comparator and adjusts the performance parameter to reduce the difference signal. Alternately, a reference signal generator generates a reference signal. A comparator receives the reference signal and a second signal from the transceiver component and generates a difference signal.