Abstract: A pipe connectable plastic bucket includes a bucket and at least two quick-connect devices. The bucket has a plurality of through holes for communication between the inside and the outside of the bucket. The at least two quick-connect devices respectively correspond to the plurality of through holes, and are disposed on the bucket. The at least two quick-connect devices are adapted to connect to pipes, and are used for allowing a fluid entering and exiting the bucket through the plurality of the through holes. The at least two quick-connect devices comprise a first quick-connect device for allowing the liquid to enter and to exit the bucket. The present invention also provides a method of using the pipe connectable plastic bucket.

Abstract: A pipe connectable plastic bucket includes a bucket and at least two quick-connect devices. The bucket has a plurality of through holes for communication between the inside and the outside of the bucket. The at least two quick-connect devices respectively correspond to the plurality of through holes, and are disposed on the bucket. The at least two quick-connect devices are adapted to connect to pipes, and are used for allowing a fluid entering and exiting the bucket through the plurality of the through holes. The at least two quick-connect devices comprise a first quick-connect device for allowing the liquid to enter and to exit the bucket. The present invention also provides a method of using the pipe connectable plastic bucket.

Abstract: A pipe connectable plastic bucket includes a bucket and at least two quick-connect devices. The bucket has a plurality of through holes for communication between the inside and the outside of the bucket. The at least two quick-connect devices respectively correspond to the plurality of through holes, and are disposed on the bucket. The at least two quick-connect devices are adapted to connect to pipes, and are used for allowing a fluid entering and exiting the bucket through the plurality of the through holes. The at least two quick-connect devices comprise a first quick-connect device for allowing the liquid to enter and to exit the bucket. The present invention also provides a method of using the pipe connectable plastic bucket.

Abstract: A method of removing a photoresist, a laminate, a method of forming a metallic pattern, a polyimide resin, and a stripper are provided. The method of removing the photoresist includes forming a release layer on a substrate, the release layer having a first surface and a second surface opposite to each other, wherein the first surface of the release layer is in contact with the substrate; forming a photoresist layer on the second surface of the release layer; and removing the release layer and the photoresist layer. The release layer is formed by a polyimide resin. The polyimide resin is obtained by performing a polymerization of tetracarboxylic dianhydrides, diamines, and phenolamines. The diamines include hydroxyfluorinated diamines, benzoic acid diamines, and aminotetramethyldisiloxanes.

Abstract: The present invention provides a photosensitive polyimide composition comprising a polyimide resin having a structural unit represented by the formula (1) and a structural unit represented by the formula (2), a quinonediazide sulfonate, a thermal curing agent, and a thermal acid generator. In the formulas (1) and (2), n is an integer of 10 to 600, Ar1 is a tetravalent organic group; Ar2 is a divalent to tetravalent organic group; Ar3 is a divalent aromatic group; and R1 is an OH group or a COOH group. The present invention also provides a photoresist film made of the above-mentioned photosensitive polyimide composition.

Abstract: The present invention provides a photosensitive polyimide composition comprising a polyimide resin having a structural unit represented by the formula (1) and a structural unit represented by the formula (2), a quinonediazide sulfonate, a thermal curing agent, and a thermal acid generator. In the formulas (1) and (2), n is an integer of 10 to 600, Ar1 is a tetravalent organic group; Ar2 is a divalent to tetravalent organic group; Ar3 is a divalent aromatic group; and R1 is an OH group or a COOH group. The present invention also provides a photoresist film made of the above-mentioned photosensitive polyimide composition.