Patents by Inventor Tz-Shiuan Yan

Tz-Shiuan Yan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7808004
    Abstract: A light emitting diode package structure having a heat-resistant cover and a method of manufacturing the same include a base, a light emitting diode chip, a plastic shell, and a packaging material. The plastic shell is in the shape of a bowl and has an injection hole thereon. After the light emitting diode chip is installed onto the base, the plastic shell is covered onto the base to fully and air-tightly seal the light emitting diode chip, and the packaging material is injected into the plastic shell through the injection hole until the plastic shell is filled up with the packaging material to form a packaging cover, and finally the plastic shell is removed to complete the LED package structure.
    Type: Grant
    Filed: March 17, 2006
    Date of Patent: October 5, 2010
    Assignee: Edison Opto Corporation
    Inventors: Tsung-Ting Sun, Hung-Ta Laio, Hung-Hsun Chou, Tz-Shiuan Yan, Kuo-Shih Hsu
  • Publication number: 20070235739
    Abstract: A structure of heat dissipation of implant type light emitting diode package having a heat column and a method of manufacturing the same include a substrate, a heat column, and a light emitting diode chip, and the heat column is implanted directly onto a predetermined position of the light emitting diode chip of the substrate and penetrated through both surfaces of a circuit board, and a distal surface of the heat column is coupled with the light emitting diode chip to form a heat conducting end, so that the operating heat produced by a light emitting diode can be dispersed from the package structure through the heat column, so as to achieve an optimal heat dissipating effect.
    Type: Application
    Filed: March 31, 2006
    Publication date: October 11, 2007
    Inventors: Tsung-Ting Sun, Hung-Ta Laio, Tz-Shiuan Yan, Po-Jen Su
  • Publication number: 20070215896
    Abstract: A light emitting diode package structure having a heat-resistant cover and a method of manufacturing the same include a base, a light emitting diode chip, a plastic shell, and a packaging material. The plastic shell is in the shape of a bowl and has an injection hole thereon. After the light emitting diode chip is installed onto the base, the plastic shell is covered onto the base to fully and air-tightly seal the light emitting diode chip, and the packaging material is injected into the plastic shell through the injection hole until the plastic shell is filled up with the packaging material to form a packaging cover, and finally the plastic shell is removed to complete the LED package structure.
    Type: Application
    Filed: March 17, 2006
    Publication date: September 20, 2007
    Inventors: Tsung-Ting Sun, Hung-Ta Laio, Hung-Hsun Chou, Tz-Shiuan Yan, Kuo-Shih Hsu
  • Publication number: 20070165392
    Abstract: A light emitting diode structure using a heat conducting medium as a grounding circuit includes a heat dissipating body, a support frame, and a base, wherein the upper half of the heat dissipating body has a circular heat dissipating column having a plane for preinstalling a light emitting diode chip, and the lower half of the heat dissipating body has a circular contact disc, and both left and right ends of the support frame separately include a plurality of pins, and a pin is connected to a circular contact end for fixing the heat dissipating column of the heat dissipating body, and then both are buried inside the base, and the bottom surface of the heat dissipating body contact disc is protruded from the bottom of the base, and the plurality of pins of the support frame is extended outward from both left and right sides of the base.
    Type: Application
    Filed: January 13, 2006
    Publication date: July 19, 2007
    Inventors: Tsung-Ting Sun, Hung-Ta Laio, Hung-Hsun Chou, Tz-Shiuan Yan