Patents by Inventor Tze-an Shen

Tze-an Shen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200032415
    Abstract: An IC fabrication system for facilitating improved thermal uniformity includes a chamber within which an IC process is performed on a substrate, a heating mechanism configured to heat the substrate, and a substrate-retaining device configured to retain the substrate in the chamber. The substrate-retaining device includes a contact surface configured to contact an edge of the retained substrate without the substrate-retaining device contacting a circumferential surface of the retained substrate. The substrate-retaining device includes a plurality of contact regions and a plurality of noncontact regions disposed at a perimeter, where the plurality of noncontact regions is interspersed with the plurality of contact regions. Each of the plurality of noncontact regions includes the contact surface.
    Type: Application
    Filed: October 7, 2019
    Publication date: January 30, 2020
    Inventors: Yi-Hung Lin, Jr-Hung Li, Chang-Shen Lu, Tze-Liang Lee, Chii-Horng Li
  • Patent number: 10509755
    Abstract: An automatic switching apparatus and an automatic switching method are disclosed. The automatic switching apparatus includes a universal serial bus Type-C input connector, a plurality of main links, at least one video output connector and at least one USB output connector. The automatic switching method includes the steps of: (a) detecting a use state of the plurality of main links; and (b) automatically switching the specification of the at least one USB output connector.
    Type: Grant
    Filed: February 14, 2018
    Date of Patent: December 17, 2019
    Assignee: ATEN International Co., Ltd.
    Inventors: Shang-Yi Yang, Sin-Hong Chen, Tze-an Shen
  • Patent number: 10435811
    Abstract: An IC fabrication system for facilitating improved thermal uniformity includes a chamber within which an IC process is performed on a substrate, a heating mechanism configured to heat the substrate, and a substrate-retaining device configured to retain the substrate in the chamber. The substrate-retaining device includes a contact surface configured to contact an edge of the retained substrate without the substrate-retaining device contacting a circumferential surface of the retained substrate. The substrate-retaining device includes a plurality of contact regions and a plurality of noncontact regions disposed at a perimeter, where the plurality of noncontact regions is interspersed with the plurality of contact regions. Each of the plurality of noncontact regions includes the contact surface.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: October 8, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD
    Inventors: Yi-Hung Lin, Jr-Hung Li, Chang-Shen Lu, Tze-Liang Lee, Chii-Horng Li
  • Publication number: 20180239732
    Abstract: An automatic switching apparatus and an automatic switching method are disclosed. The automatic switching apparatus includes a universal serial bus Type-C input connector, a plurality of main links, at least one video output connector and at least one USB output connector. The automatic switching method includes the steps of: (a) detecting a use state of the plurality of main links; and (b) automatically switching the specification of the at least one USB output connector.
    Type: Application
    Filed: February 14, 2018
    Publication date: August 23, 2018
    Applicant: ATEN International Co., Ltd.
    Inventors: Shang-Yi Yang, Sin-Hong Chen, Tze-an Shen