Abstract: An integrated circuit (IC) die includes first through third adjacent rows of through-silicon vias (TSVs), and first and second adjacent rows of memory macros. TSVs of the first row of TSVs extend through and are electrically isolated from memory macros of the first row of memory macros. TSVs of the third row of TSVs extend through and are electrically isolated from memory macros of the second row of memory macros.

Abstract: An all-in-one computer including a main body and an electronic assembly is provided. The main body includes a first casing part and a second casing part. The second casing part is movably connected to the first casing part and configured to move between a first position and a second position in relative to the first casing part, and the first casing part has an engaging portion and an electrical connection portion. The electronic assembly is disposed in the second casing part. When the second casing part is located at the first position, the second casing part is engaged with the engaging portion and the electronic assembly is connected to the electrical connection portion, and when the second casing part is located at the second position, the second casing part is departed from the engaging portion and the electronic assembly is departed from the electrical connection portion.

Abstract: An electronic device including a main body, a frame and a display is provided. The frame is pivotally connected to the main body. The display is detachably assembled to the frame and configured to rotate between a first state and a second state in relative to the main body with the frame. When the display is rotated in relative to the main body to the first state, the display closes the main body. When the display is rotated in relative to the main body to the second state, the display is departed from the main body, so as to be detached from the main body and the frame.

Abstract: An all-in-one computer including a main body and an electronic assembly is provided. The main body includes a first casing part and a second casing part. The second casing part is movably connected to the first casing part and configured to move between a first position and a second position in relative to the first casing part, and the first casing part has an engaging portion and an electrical connection portion. The electronic assembly is disposed in the second casing part. When the second casing part is located at the first position, the second casing part is engaged with the engaging portion and the electronic assembly is connected to the electrical connection portion, and when the second casing part is located at the second position, the second casing part is departed from the engaging portion and the electronic assembly is departed from the electrical connection portion.

Abstract: An electronic device including a main body, a frame and a display is provided. The frame is pivotally connected to the main body. The display is detachably assembled to the frame and configured to rotate between a first state and a second state in relative to the main body with the frame. When the display is rotated in relative to the main body to the first state, the display closes the main body. When the display is rotated in relative to the main body to the second state, the display is departed from the main body, so as to be detached from the main body and the frame.

Abstract: The present invention relates to random vinyl substituted aromatic/C.sub.4 -C.sub.6 conjugated diolefin polymer modified asphalt mixtures wherein the modifier is a keto-containing amide such as diacetone acrylamide (DAAM), an oxazoline containing copolymer, and an ethoxylated trimethylolpropane triacrylate.

Abstract: The present invention relates to a method for improving the compatibility of random vinyl substituted aromatic/C.sub.4 -C.sub.6 conjugated diolefin polymer/asphalt mixtures comprising adding a modifier to said random vinyl substituted aromatic/C.sub.4 -C.sub.6 conjugated diolefin polymer/asphalt mixture selected from the group consisting of:(a) polymers containing an epoxy functionality(b) polymers containing a carboxyl functionality(c) monomers, oligomers, and polymers containing an amine functionality;(d) monomers, oligomers, and polymers containing an ester functionality; or mixtures thereof.

Abstract: An aqueous polymer composition comprising 10 to 40 wt % of a polymer in water, the polymer consisting essentially of 20-90 wt % .alpha.,.beta.-ethylenically unsaturated carboxylic acid monomer, 10-80 wt % one or more softening monomers, the aqueous composition being adjusted to pH 4-6 with alkali metal hydroxide or alkaline earth metal hydroxide and further containing 0.1 to 3 wt % zirconium crosslinking salt. Such aqueous compositions can be applied to nonwoven and woven substrates to make superabsorbent products.

Abstract: A pressure sensitive adhesive composition comprising an aqueous emulsion of a copolymer consisting essentially of(a) 10-40 wt % vinyl acetate,(b) 5-30 wt % ethylene,(c) 5-50 wt % alkyl acrylate,(d) 5-40 wt % dialkyl maleate or fumarate,(e) 1-5 wt % hydroxyalkyl (meth)acrylate,(f) 0.1-1 wt % (meth)acrylamide, and(g) 1-5 wt % alpha,beta ethylenically unsaturated carboxylic acid.

Abstract: A process for making an aqueous vinyl acetate/ethylene/N-methylolacrylamide copolymer emulsion comprising:(a) adding an initial charge containing all the vinyl acetate monomer to be polymerized and an effective amount of an emulsifying system consisting essentially of an anionic surfactant, especially a salt of an alkylphenoxy poly(ethyleneoxy) sulfate containing about 3-5 ethyleneoxy units,(b) pressurizing the reactor with sufficient ethylene to yield a copolymer having the desired Tg,(c) initiating polymerization at a temperature from 45.degree. to 85.degree. C., and(d) continuing polymerization at a temperature from 45.degree. to 85.degree. C., while continuously adding N-methylolacrylamide over a period of time such that the free vinyl acetate monomer content of the reaction medium is about 2-4% upon completion of the N-methylolacrylamide addition.