Patents by Inventor TZE CHUN LIU

TZE CHUN LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Over-voltage protection device and method for preparing the same
    Patent number: 9099861
    Abstract: An over-voltage protection device includes a substrate, an insulation layer having a depression over the substrate, a conductor layer having a first electrode and a second electrode over the insulation layer, wherein the first electrode and the second electrode form a discharge path, and the depression is under the discharge path. A method for preparing the over-voltage protection device includes the steps of forming an insulation layer over a substrate; forming a depression in the insulation layer; forming a photoresist pattern filling the depression and protruding the insulation layer; forming a conductor layer over the insulation layer; and removing the photoresist pattern, wherein the photoresist pattern divides the conductor layer into a first electrode and a second electrode that form a discharge path, and the depression is under the discharge path after the removal of the photoresist pattern.
    Type: Grant
    Filed: May 23, 2013
    Date of Patent: August 4, 2015
    Assignee: INPAQ TECHNOLOGY CO., LTD.
    Inventors: Hsiu Lun Yeh, Yu Chia Chang, Tze Chun Liu, Hsiu Mei Hsu
  • OVER-VOLTAGE PROTECTION DEVICE AND METHOD FOR PREPARING THE SAME
    Publication number: 20140347772
    Abstract: An over-voltage protection device includes a substrate, an insulation layer having a depression over the substrate, a conductor layer having a first electrode and a second electrode over the insulation layer, wherein the first electrode and the second electrode form a discharge path, and the depression is under the discharge path. A method for preparing the over-voltage protection device includes the steps of forming an insulation layer over a substrate; forming a depression in the insulation layer; forming a photoresist pattern filling the depression and protruding the insulation layer; forming a conductor layer over the insulation layer; and removing the photoresist pattern, wherein the photoresist pattern divides the conductor layer into a first electrode and a second electrode that form a discharge path, and the depression is under the discharge path after the removal of the photoresist pattern.
    Type: Application
    Filed: May 23, 2013
    Publication date: November 27, 2014
    Applicant: INPAQ TECHNOLOGY CO., LTD.
    Inventors: HSIU LUN YEH, YU CHIA CHANG, TZE CHUN LIU, HSIU MEI HSU